CIRCUIT SUBSTRATE FOR CARRYING AT LEAST ONE LIGHT-EMITTING DIODE AND LIGHT-EMITTING STRUCTURE FOR PROVIDING ILLUMINATION

• US 20160109071A1
• Filed: 01/26/2015
• Published: 04/21/2016
• Est. Priority Date: 10/15/2014
• Status: Active Grant

• Current Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.
• Original Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.
• Inventors: CHUNG, CHIA-TIN
• Granted Patent: US 9,803,846 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F21V 29/50 Cooling arrangements air-treatment systems dissipating or using the heat of lighting fixtures F24F3/056
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/0207 using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
• CPC Class Codes: H05K 2201/09027 Non-rectangular flat PCB, e.g. circular
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

A circuit substrate for carrying at least one light-emitting diode and a light-emitting structure for providing illumination are disclosed. The circuit substrate includes an insulation base layer, a conductive heat-dissipating layer, an insulation covering layer, a conductive circuit structure and a conductive through structure. The conductive heat-dissipating layer is disposed on the insulation base layer. The insulation covering layer is disposed on the conductive heat-dissipating layer. The conductive circuit structure includes a first electrode conductive layer and a second electrode conductive layer that are disposed on the insulation covering layer. The conductive through structure passes through the insulation covering layer and is connected between the conductive heat-dissipating layer and one of the first electrode conductive layer and the second electrode conductive layer. One of the first electrode conductive layer and the second electrode conductive layer is electrically connected to the conductive heat-dissipating layer through the conductive body.

Claims

1. A circuit substrate for carrying at least one light-emitting diode, comprising:

an insulation base layer;

a conductive heat-dissipating layer disposed on the insulation base layer;

an insulation covering layer disposed on the conductive heat-dissipating layer;

a conductive circuit structure including at least one first electrode conductive layer and at least one second electrode conductive layer, wherein the at least one first electrode conductive layer and the at least one second electrode conductive layer are disposed on the insulation covering layer and separated from each other; and

a conductive through structure including at least one through hole passing through the insulation covering layer and a conductive body for filling the at least one through hole, wherein both the at least one through hole and the conductive body are connected between the conductive heat-dissipating layer and one of the at least one first electrode conductive layer and the at least one second electrode conductive layer;

wherein the at least one light-emitting diode is disposed on the conductive circuit structure and electrically connected between the at least one first electrode conductive layer and the at least one second electrode conductive layer;

wherein one of the at least one first electrode conductive layer and the at least one second electrode conductive layer is electrically connected to the conductive heat-dissipating layer through the conductive body.

2. The circuit substrate of claim 1, further comprising:

a light-reflecting coating layer disposed on the conductive circuit structure, wherein the at least one first electrode conductive layer has a first conductive pad exposed from the light-reflecting coating layer, the at least one second electrode conductive layer has a second conductive pad exposed from the light-reflecting coating layer, and the at least one light-emitting diode is electrically connected between the first conductive pad and the second conductive pad.

3. The circuit substrate of claim 1, wherein the material of the conductive heat-dissipating layer is different from that of the conductive circuit structure, the insulation base layer is a silicone layer, the conductive heat-dissipating layer is an aluminum layer, the insulation covering layer is a prepreg, and both the at least one first electrode conductive layer, and the at least one second electrode conductive layer are copper layers.

4. A circuit substrate for carrying at least one light-emitting diode, comprising:

an insulation base layer;

a conductive heat-dissipating layer disposed on the insulation base layer;

an embedded insulation layer disposed on the conductive heat-dissipating layer;

an embedded conductive layer disposed on the embedded insulation layer;

an insulation covering layer disposed on the embedded conductive layer;

a conductive circuit structure including at least one first electrode conductive layer and at least one second electrode conductive layer, wherein the at least one first electrode conductive layer and the at least one second electrode conductive layer are disposed on the insulation covering layer and separated from each other; and

a conductive through structure including at least one through hole passing through the insulation covering layer and a conductive body for filling the at least one through hole, wherein both the at least one through hole and the conductive body are connected between the embedded conductive layer and one of the at least one first electrode conductive layer and the at least one second electrode conductive layer;

wherein the at least one light-emitting diode is disposed on the conductive circuit structure and electrically connected between the at least one first electrode conductive layer and the at least one second electrode conductive layer;

wherein one of the at least one first electrode conductive layer and the at least one second electrode conductive layer is electrically connected to the embedded conductive layer through the conductive body.

5. The circuit substrate of claim 4, further comprising:

a light-reflecting coating layer disposed on the conductive circuit structure, wherein the at least one first electrode conductive layer has a first conductive pad exposed from the light-reflecting coating layer, the at least one second electrode conductive layer has a second conductive pad exposed from the light-reflecting coating layer, and the at least one light-emitting diode is electrically connected between the first conductive pad and the second conductive pad.

6. The circuit substrate of claim 4, wherein the material of the conductive heat-dissipating layer is different from that of the embedded conductive layer, the material of the conductive heat-dissipating layer is different from that of the conductive circuit structure, and the material of the embedded conductive layer is the same as that of the conductive circuit structure, wherein the insulation base layer is a silicone layer, the conductive heat-dissipating layer is an aluminum layer, the insulation covering layer is a prepreg, and all of the embedded conductive layer, the at least one first electrode conductive layer, and the at least one second electrode conductive layer are copper layers.

7. A light-emitting structure for providing illumination, comprising:

a circuit substrate comprising;

an insulation base layer;

a conductive heat-dissipating layer disposed on the insulation base layer;

an insulation covering layer disposed on the conductive heat-dissipating layer;

a conductive circuit structure including at least one first electrode conductive layer and at least one second electrode conductive layer, wherein the at least one first electrode conductive layer and the at least one second electrode conductive layer are disposed on the insulation covering layer and separated from each other; and

a conductive through structure including at least one through hole passing through the insulation covering layer and a conductive body for filling the at least one through hole, wherein both the at least one through hole and the conductive body are connected between the conductive heat-dissipating layer and one of the at least one first electrode conductive layer and the at least one second electrode conductive layer, and one of the at least one first electrode conductive layer and the at least one second electrode conductive layer is electrically connected to the conductive heat-dissipating layer through the conductive body; and

a light-emitting unit including at least one light-emitting diode disposed on the conductive circuit structure and electrically connected between the at least one first electrode conductive layer and the at least one second electrode conductive layer.

8. The light-emitting structure of claim 7, wherein the circuit substrate comprises a light-reflecting coating layer disposed on the conductive circuit structure, wherein the at least one first electrode conductive layer has a first conductive pad exposed from the light-reflecting coating layer, the at least one second electrode conductive layer has a second conductive pad exposed from the light-reflecting coating layer, and the at least one light-emitting diode is electrically connected between the first conductive pad and the second conductive pad.

9. The light-emitting structure of claim 7, wherein the material of the conductive heat-dissipating layer is different from that of the conductive circuit structure, the insulation base layer is a silicone layer, the conductive heat-dissipating layer is an aluminum layer, the insulation covering layer is a prepreg, and both the at least one first electrode conductive layer, and the at least one second electrode conductive layer are copper layers.