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CIRCUIT SUBSTRATE FOR CARRYING AT LEAST ONE LIGHT-EMITTING DIODE AND LIGHT-EMITTING STRUCTURE FOR PROVIDING ILLUMINATION

  • US 20160109071A1
  • Filed: 01/26/2015
  • Published: 04/21/2016
  • Est. Priority Date: 10/15/2014
  • Status: Active Grant
First Claim
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1. A circuit substrate for carrying at least one light-emitting diode, comprising:

  • an insulation base layer;

    a conductive heat-dissipating layer disposed on the insulation base layer;

    an insulation covering layer disposed on the conductive heat-dissipating layer;

    a conductive circuit structure including at least one first electrode conductive layer and at least one second electrode conductive layer, wherein the at least one first electrode conductive layer and the at least one second electrode conductive layer are disposed on the insulation covering layer and separated from each other; and

    a conductive through structure including at least one through hole passing through the insulation covering layer and a conductive body for filling the at least one through hole, wherein both the at least one through hole and the conductive body are connected between the conductive heat-dissipating layer and one of the at least one first electrode conductive layer and the at least one second electrode conductive layer;

    wherein the at least one light-emitting diode is disposed on the conductive circuit structure and electrically connected between the at least one first electrode conductive layer and the at least one second electrode conductive layer;

    wherein one of the at least one first electrode conductive layer and the at least one second electrode conductive layer is electrically connected to the conductive heat-dissipating layer through the conductive body.

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