PRESSURE SENSORS AND METHODS OF MAKING THE SAME
First Claim
1. A pressure sensor assembly comprising:
- a first silicon wafer with a top and a bottom;
a cavity formed in the silicon wafer, the cavity extending from the bottom of the first silicon wafer up towards the top of the first silicon wafer to form a cavity bottom such that a diaphragm is formed between the cavity bottom and the top of the first silicon wafer;
an electrical circuit formed by a conductive layer deposited on the top of the first silicon wafer;
a second silicon wafer coupled along the bottom of the first silicon wafer and covering the cavity to form a chamber;
a dielectric layer that electrically isolates an interior of the chamber from the first silicon wafer;
a plurality of ports located on a top of the second silicon wafer within an area defined by the cavity, the plurality of ports extending through the second silicon wafer to a bottom of the second silicon wafer;
a third silicon wafer coupled to the top of the first silicon wafer such that the third silicon wafer covers the diaphragm; and
,a second cavity cut into a bottom of the third silicon wafer wherein the second cavity is sized and positioned such that the second cavity surrounds the diaphragm.
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Abstract
A pressure sensor assembly comprising: three stacked silicon wafers which form a support, a sensor and a cover wherein the sensor includes a cavity extending from the bottom of the sensor up towards the top of the sensor to form a cavity bottom and a diaphragm; a dielectric layer covering the bottom of the sensor and the cavity and wherein the support is coupled to the dielectric layer along the bottom of the sensor; a plurality of ports located on a top of the support within an area defined by the cavity, the plurality of ports extending through the support to its bottom and wherein the cover is coupled to the top of the sensor covering the diaphragm; and, a second cavity cut into a bottom of the cover wherein the second cavity is sized and positioned to surround the diaphragm.
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Citations
20 Claims
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1. A pressure sensor assembly comprising:
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a first silicon wafer with a top and a bottom; a cavity formed in the silicon wafer, the cavity extending from the bottom of the first silicon wafer up towards the top of the first silicon wafer to form a cavity bottom such that a diaphragm is formed between the cavity bottom and the top of the first silicon wafer; an electrical circuit formed by a conductive layer deposited on the top of the first silicon wafer; a second silicon wafer coupled along the bottom of the first silicon wafer and covering the cavity to form a chamber; a dielectric layer that electrically isolates an interior of the chamber from the first silicon wafer; a plurality of ports located on a top of the second silicon wafer within an area defined by the cavity, the plurality of ports extending through the second silicon wafer to a bottom of the second silicon wafer; a third silicon wafer coupled to the top of the first silicon wafer such that the third silicon wafer covers the diaphragm; and
,a second cavity cut into a bottom of the third silicon wafer wherein the second cavity is sized and positioned such that the second cavity surrounds the diaphragm. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A pressure sensor assembly comprising:
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a first silicon wafer having a top surface and a bottom surface and a mid-plane defined half-way between the top surface and the bottom surface wherein the bottom surface includes a cavity that extends up towards the top surface past the mid-plane to a cavity bottom; a diaphragm formed between the cavity bottom and the top surface; a second silicon wafer coupled to the bottom surface of the first silicon wafer, the second silicon wafer covering the cavity to form a chamber; a plurality of channels that extend through the second silicon wafer and into the chamber; a third silicon wafer coupled to the top surface of the first silicon wafer, the third silicon wafer including a second cavity, the second cavity sized and positioned to cover the diaphragm and wherein a bottom of the second cavity forms a mechanical stop for the diaphragm; and wherein the chamber is electrically isolated from the first silicon wafer by a dielectric layer. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A pressure sensor assembly comprising:
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a sensor with a diaphragm, the sensor having a top and a bottom; a cover coupled to the top of the sensor and forming a gap above the diaphragm designed to limit the full scale motion of the diaphragm; a support coupled to the bottom of the sensor, wherein the support and the sensor form a chamber adjacent the diaphragm and wherein the support includes a plurality of channels that pass from a bottom of the support through the support up into the chamber; and a dielectric layer electrically isolating the chamber and the channels from the sensor. - View Dependent Claims (18, 19, 20)
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Specification