MICROELECTROMECHANICAL VIBRATION SENSOR
First Claim
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1. A microelectromechanical vibration sensor comprising:
- a first chamber;
a second chamber;
a semiconductor membrane between the first chamber and the second chamber;
a reference electrode capacitively coupled to the membrane; and
a package structure that encapsulates and acoustically isolates the first chamber, the second chamber and the membrane from environments outside of the package structure.
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Abstract
A microelectromechanical vibration sensor includes: a first chamber; a second chamber; a semiconductor membrane between the first chamber and the second chamber; a reference electrode, capacitively coupled to the membrane; and a package structure, which encapsulates and insulates acoustically from the outside world the first chamber, the second chamber, and the membrane.
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Citations
20 Claims
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1. A microelectromechanical vibration sensor comprising:
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a first chamber; a second chamber; a semiconductor membrane between the first chamber and the second chamber; a reference electrode capacitively coupled to the membrane; and a package structure that encapsulates and acoustically isolates the first chamber, the second chamber and the membrane from environments outside of the package structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An electronic device comprising:
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a microelectromechanical vibration sensor including; a first chamber; a second chamber; a semiconductor membrane between the first chamber and the second chamber; a reference electrode capacitively coupled to the membrane and ; and a package structure that encapsulates and acoustically isolates the first chamber, the second chamber and the membrane from environments external to the package structure; and a touch-screen, the microelectromechanical vibration sensor being rigidly coupled to the touch-screen, wherein the microelectromechanical vibration sensor is configured to detect vibrations of the touch-screen. - View Dependent Claims (12, 13, 14, 15)
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16. A method comprising:
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forming a microelectromechanical vibration sensor that includes a first chamber and a second chamber, a semiconductor membrane between the first and second chambers, and a reference electrode that is capacitively coupled to the membrane; and rigidly coupling a touch-screen to the microelectromechanical vibration sensor, wherein the microelectromechanical vibration sensor is configured to detect vibrations of the touch-screen, wherein the microelectromechanical vibration sensor includes a package structure that encapsulates and acoustically isolates the first and second chambers and the membrane from the environment external to the package structure. - View Dependent Claims (17, 18, 19, 20)
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Specification