MICROELECTROMECHANICAL VIBRATION SENSOR

• US 20160117015A1
• Filed: 08/28/2015
• Published: 04/28/2016
• Est. Priority Date: 10/28/2014
• Status: Abandoned Application

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: Veneri, Marco, Morcelli, Alessandro, Bosco, Stefano
• Application Number:
  US14/839,604
• Publication Number:
  US 20160117015A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0285 Vibration sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: G01H 11/06 by electric means
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/0433 in which the acoustic waves are either generated by a movable member and propagated within a surface layer or propagated within a surface layer and captured by a movable member
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate

Abstract

A microelectromechanical vibration sensor includes: a first chamber; a second chamber; a semiconductor membrane between the first chamber and the second chamber; a reference electrode, capacitively coupled to the membrane; and a package structure, which encapsulates and insulates acoustically from the outside world the first chamber, the second chamber, and the membrane.

Claims

1. A microelectromechanical vibration sensor comprising:

a first chamber;

a second chamber;

a semiconductor membrane between the first chamber and the second chamber;

a reference electrode capacitively coupled to the membrane; and

a package structure that encapsulates and acoustically isolates the first chamber, the second chamber and the membrane from environments outside of the package structure.

2. The sensor according to claim 1, comprising a substrate having a cavity that defines the first chamber.

3. The sensor according to claim 2, wherein the membrane is anchored to the substrate and is arranged to cover one side of the first chamber.

4. The sensor according to claim 3, wherein the first chamber is delimited by the package structure on a side opposite to the membrane.

5. The sensor according to claim 2, comprising a supporting structure joined to the substrate and supporting the reference electrode.

6. The sensor according to claim 5, wherein the supporting structure delimits at least in part the second chamber.

7. The sensor according to claim 5, wherein the supporting structure comprises a rigid dielectric plate.

8. The sensor according to claim 5, wherein the supporting structure comprises a semiconductor body.

9. The sensor according to claim 1, wherein the package structure comprises an integrated circuit package.

10. The sensor according to claim 1, comprising an auxiliary mass coupled to the membrane.

11. An electronic device comprising:

a microelectromechanical vibration sensor including;

a first chamber;

a second chamber;

a semiconductor membrane between the first chamber and the second chamber;

a reference electrode capacitively coupled to the membrane and ; and

a package structure that encapsulates and acoustically isolates the first chamber, the second chamber and the membrane from environments external to the package structure; and

a touch-screen, the microelectromechanical vibration sensor being rigidly coupled to the touch-screen, wherein the microelectromechanical vibration sensor is configured to detect vibrations of the touch-screen.

12. The device according to claim 11, comprising a processing unit coupled to the microelectromechanical sensor.

13. The device according to claim 12, wherein the processing unit comprises a memory module, containing templates of typical touch-events, and a classification engine, configured to classify touch-events detected by the microelectromechanical vibration sensor based on the templates stored in the memory module.

14. The device according to claim 11, wherein the package structure comprises a portion of the touch-screen.

15. The device according to claim 11, wherein the device is at least one of a tablet, a portable computer, a wearable device, and a filming device.

16. A method comprising:

forming a microelectromechanical vibration sensor that includes a first chamber and a second chamber, a semiconductor membrane between the first and second chambers, and a reference electrode that is capacitively coupled to the membrane; and

rigidly coupling a touch-screen to the microelectromechanical vibration sensor, wherein the microelectromechanical vibration sensor is configured to detect vibrations of the touch-screen,

wherein the microelectromechanical vibration sensor includes a package structure that encapsulates and acoustically isolates the first and second chambers and the membrane from the environment external to the package structure.

17. The method according to claim 16, wherein rigidly coupling the touch-screen to the microelectromechanical vibration sensor forms part of the package structure that encapsulates and acoustically isolates the first and second chambers and the membrane from the environment external to the package structure.

18. The method according to claim 16, wherein forming the microelectromechanical vibration sensor includes forming package structure, and forming the package structure occurs before rigidly coupling the touch-screen to the microelectromechanical vibration sensor.

19. The method according to claim 16, wherein forming the microelectromechanical vibration sensor includes coupling an integrated circuit to the reference electrode and the membrane.

20. The method according to claim 16, wherein forming the microelectromechanical vibration sensor includes coupling an auxiliary mass to the membrane.