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MICROELECTROMECHANICAL VIBRATION SENSOR

  • US 20160117015A1
  • Filed: 08/28/2015
  • Published: 04/28/2016
  • Est. Priority Date: 10/28/2014
  • Status: Abandoned Application
First Claim
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1. A microelectromechanical vibration sensor comprising:

  • a first chamber;

    a second chamber;

    a semiconductor membrane between the first chamber and the second chamber;

    a reference electrode capacitively coupled to the membrane; and

    a package structure that encapsulates and acoustically isolates the first chamber, the second chamber and the membrane from environments outside of the package structure.

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