TOUCH DEVICE AND MANUFACTURING METHOD THEREOF

• US 20160117018A1
• Filed: 10/11/2015
• Published: 04/28/2016
• Est. Priority Date: 10/21/2014
• Status: Active Grant

• Current Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Original Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Inventors: Lin, Ching-Shan, Chiang, Cheng-Chung, Tseng, Chan-Hao
• Granted Patent: US 10,037,113 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G02F 1/133345 Insulating layers G02F1/1335, G02F1/1337, G02F1/135, G02F1/136 take precedence
• CPC Class Codes: G02F 1/13338 Input devices, e.g. touch panels
• CPC Class Codes: G02F 1/133528 Polarisers
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 2203/04112 Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

A touch device includes a cover plate, a carrying structure, a first sensor layer, a dielectric layer and a second sensor layer. The carrying structure is disposed on the cover plate and includes a film layer and a buffer layer stacked on each other. The film is located between the cover plate and the buffer layer. The first sensor layer is at least disposed on the carrying structure. The first sensor layer and the cover plate are respectively located at two opposite sides of the carrying structure. The dielectric layer is disposed on the first sensor layer. The dielectric layer and the carrying structure are respectively located at two opposite sides of the first sensor layer. The second sensor layer is at least disposed on the dielectric layer. The second sensor layer and the first sensor layer are respectively located at two opposite sides of the dielectric layer.

Claims

1. A touch device, comprising:

a cover plate;

a carrying structure disposed on the cover plate and including a film layer and a buffer layer stacked on each other, wherein the film layer is located between the cover plate and the buffer layer;

a first sensor layer at least disposed on the carrying structure, wherein the first sensor layer and the cover plate are respectively located at two opposite sides of the carrying structure;

a dielectric layer disposed on the first sensor layer, wherein the dielectric layer and the carrying structure are respectively located at two opposite sides of the first sensor layer; and

a second sensor layer at least disposed on the dielectric layer, wherein the second sensor layer and the first sensor layer are respectively located at two opposite sides of the dielectric layer.

2. The touch device of claim 1, further comprising a protection layer disposed on the second sensor layer, wherein the protection layer and the dielectric layer are respectively located at two opposite sides of the second sensor layer.

3. The touch device of claim 2, further comprising a substrate with polarity and disposed on the protection layer, wherein the substrate and the second sensor layer are respectively located at two opposite sides of the protection layer.

4. The touch device of claim 3, further comprising a liquid crystal module, wherein the liquid crystal module includes a main body having liquid crystal molecules and a polarized layer having polarity direction perpendicular to the substrate, and the polarized layer and the substrate are located at two opposite sides of the main body.

5. The touch device of claim 1, further comprising a mask layer disposed on the cover plate and between the cover plate and the carrying structure.

6. The touch device of claim 5, wherein the first sensor layer includes a plurality of first sensing electrodes and a plurality of first wires, the first sensing electrodes are spaced apart from each other on the carrying structure, the first wires are disposed on the carrying structure, have positions corresponding to the mask layer and being respectively connected to the first sensing electrodes, and wherein the second sensor layer includes a plurality of second sensing electrodes and a plurality of second wires, the second sensing electrodes are spaced apart from each other on the dielectric layer and have an extension direction different from that of the first sensing electrodes, the second wires are disposed on the dielectric layer, have positions corresponding to the mask layer, and respectively connect to the second sensing electrodes.

7. The touch device of claim 6, wherein the dielectric layer has an area smaller that of the carrying structure, and the second wires extend across the dielectric layer to the carrying structure.

8. The touch device of claim 6, wherein the first wires are uncovered by the dielectric layer.

9. The touch device of claim 5, wherein the dielectric layer is formed a plurality of openings which are respectively corresponding to the first sensor layer, the first sensor layer includes a plurality of first sensing electrodes and a plurality of first wires, the first sensing electrodes are spaced apart from each other on the carrying structure, the first wires are primarily disposed on the dielectric layer, having positions corresponding to the mask layer and extending through the openings to be respectively connected to the first sensing electrodes, and wherein the second sensor layer includes a plurality of second sensing electrodes and a plurality of second wires, the second sensing electrodes are spaced apart from each other on the dielectric layer and extends along in a direction different from that of the first sensing electrodes, the second wires are disposed on the dielectric layer, having positions corresponding to the mask layer and respectively connects to the second sensing electrodes.

10. A manufacturing method of a touch device, comprising:

step (A1), providing a cover plate and a first substrate;

step (A2), forming a carrying structure on the first substrate, the carrying structure including a film;

step (A3) forming a plurality of the first sensing electrodes on the carrying structure, the first sensing electrodes and the cover plate being respectively located at two opposite sides of the carrying structure;

step (A4), forming a dielectric layer on the first sensing electrodes, the dielectric layer and the film being respectively formed on two opposite sides of the first sensing electrodes;

step (A5), forming a plurality of second sensing electrodes on the dielectric layer, the first sensing electrodes being respectively located at two opposite sides of the dielectric layer;

step (A6), disposing a second substrate, the second substrate and the dielectric layer being respectively located at two opposite sides of the second sensing electrodes; and

step (A7), removing the first substrate to form a structural assembly, the cover plate being laminated to the film of the structural assembly.

11. The manufacturing method of a touch device of claim 10, wherein the second substrate has polarity, the step (A1) further including providing a liquid crystal module, the liquid crystal module including a main body having liquid crystal molecules and a polarized layer, the polarized layer having polarity direction perpendicular to the second substrate, posterior to the step (A7), the manufacturing method further comprising the step (B1) of laminating the liquid crystal module and the second substrate, the polarized layer and the second substrate being located at two opposite sides of the main body.

12. The manufacturing method of a touch device of claim 10, further comprising the step (C1) of removing the second substrate step posterior to the step (A7).

13. The manufacturing method of a touch device of claim 10, further comprising the step (D1) of forming a first adhesive layer on a portion of a surface of the first substrate between the steps (A1) and (A2), in the step (A2), the first adhesive layer being located between the film and the first substrate, the manufacturing method further comprising a step (D2) of cutting along a periphery of the first adhesive layer between step (A6) and step (A7).

14. The manufacturing method of a touch device of claim 10, wherein the carrying structure further includes a buffer layer, in the step (A3), the first sensing electrodes being formed on the buffer layer, the first sensing electrodes and the film being respectively located at two opposite sides of the buffer layer.

15. The manufacturing method of a touch device of claim 10, further comprising the step (E1) of forming a protection layer on the second sensing electrodes between the steps (A5) and (A6), the protection layer and the dielectric layer being respectively located at two opposite sides of the second sensing electrode, in the step (A6), the second substrate being dispose on the protection layer, the second substrate and the second sensing electrodes being respectively located at two opposite sides of the protection layer.

16. The manufacturing method of a touch device of claim 10, wherein the step (A1) of providing the cover plate further includes forming of a mask layer on the cover plate, in the step(A2), the mask layer being interposed between the cover plate and the film.

17. The manufacturing method of a touch device of claim 16, further comprising the step (F1) of forming a plurality of first wires on the carrying structure between the steps (A3) and (A4), the first wires being respectively connected to the first sensing electrodes and having positions corresponding to the mask layer, the first wires and the cover plate being respectively located at two opposite sides of the carrying structure;

and

the step (F2) of forming a plurality of second wires on the dielectric layer between the steps (A5) and (A6), the second wires being respectively connected to the second sensing electrodes and having positions corresponding to the mask layer, the second wires being at least disposed on the dielectric layer.

18. The manufacturing method of a touch device of claim 17, wherein the dielectric layer has an area smaller than that of the carrying structure, and in the step (A5), the second wires extends across the dielectric layer to the carrying structure.

19. The manufacturing method of a touch device of claim 16, wherein in the step (A4), the first sensing electrodes are partially uncovered by the dielectric layer, the manufacturing method further comprising the step (G1) of forming a plurality of first wires on the carrying structure between the steps (A5) and the step (A6), the first wires being respectively connected to the first sensing electrodes, having positions corresponding to the mask layer, and at least forming a plurality of second wires on the dielectric layer, the second wires being respectively connected to the second sensing electrodes and having positions corresponding to the mask layer.

20. The manufacturing method of a touch device of claim 16, wherein in the step (A4), the dielectric layer are formed a plurality of openings with positions corresponding to the first sensing electrodes;

and wherein the method further includes a step (H1) between the steps (A5) and (A6), a plurality of first wires and a plurality of second wires being formed on the dielectric layer, positions of the first wires having positions corresponding to the mask layer, the first wires extending through the openings to be respectively connected to the first sensing electrodes, positions of the second wires corresponding to the mask layer, the second wires being respectively connected to the second sensing electrodes.