TOUCH DEVICE AND MANUFACTURING METHOD THEREOF
First Claim
1. A touch device, comprising:
- a cover plate;
a carrying structure disposed on the cover plate and including a film layer and a buffer layer stacked on each other, wherein the film layer is located between the cover plate and the buffer layer;
a first sensor layer at least disposed on the carrying structure, wherein the first sensor layer and the cover plate are respectively located at two opposite sides of the carrying structure;
a dielectric layer disposed on the first sensor layer, wherein the dielectric layer and the carrying structure are respectively located at two opposite sides of the first sensor layer; and
a second sensor layer at least disposed on the dielectric layer, wherein the second sensor layer and the first sensor layer are respectively located at two opposite sides of the dielectric layer.
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Accused Products
Abstract
A touch device includes a cover plate, a carrying structure, a first sensor layer, a dielectric layer and a second sensor layer. The carrying structure is disposed on the cover plate and includes a film layer and a buffer layer stacked on each other. The film is located between the cover plate and the buffer layer. The first sensor layer is at least disposed on the carrying structure. The first sensor layer and the cover plate are respectively located at two opposite sides of the carrying structure. The dielectric layer is disposed on the first sensor layer. The dielectric layer and the carrying structure are respectively located at two opposite sides of the first sensor layer. The second sensor layer is at least disposed on the dielectric layer. The second sensor layer and the first sensor layer are respectively located at two opposite sides of the dielectric layer.
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Citations
20 Claims
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1. A touch device, comprising:
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a cover plate; a carrying structure disposed on the cover plate and including a film layer and a buffer layer stacked on each other, wherein the film layer is located between the cover plate and the buffer layer; a first sensor layer at least disposed on the carrying structure, wherein the first sensor layer and the cover plate are respectively located at two opposite sides of the carrying structure; a dielectric layer disposed on the first sensor layer, wherein the dielectric layer and the carrying structure are respectively located at two opposite sides of the first sensor layer; and a second sensor layer at least disposed on the dielectric layer, wherein the second sensor layer and the first sensor layer are respectively located at two opposite sides of the dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A manufacturing method of a touch device, comprising:
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step (A1), providing a cover plate and a first substrate; step (A2), forming a carrying structure on the first substrate, the carrying structure including a film; step (A3) forming a plurality of the first sensing electrodes on the carrying structure, the first sensing electrodes and the cover plate being respectively located at two opposite sides of the carrying structure; step (A4), forming a dielectric layer on the first sensing electrodes, the dielectric layer and the film being respectively formed on two opposite sides of the first sensing electrodes; step (A5), forming a plurality of second sensing electrodes on the dielectric layer, the first sensing electrodes being respectively located at two opposite sides of the dielectric layer; step (A6), disposing a second substrate, the second substrate and the dielectric layer being respectively located at two opposite sides of the second sensing electrodes; and step (A7), removing the first substrate to form a structural assembly, the cover plate being laminated to the film of the structural assembly. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification