MICROPROCESSOR ASSEMBLY ADAPTED FOR FLUID COOLING

• US 20160118317A1
• Filed: 09/24/2015
• Published: 04/28/2016
• Est. Priority Date: 10/27/2014
• Status: Active Grant

• Current Assignee: Ebullient, Inc.
• Original Assignee: Ebullient LLC
• Inventors: Shedd, Timothy A., Lindeman, Brett A., Buchanan, Robert A.
• Granted Patent: US 9,852,963 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F25B 23/006 boiling cooling systems
• CPC Class Codes: F25B 41/40 Fluid line arrangements
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28F 13/02 by influencing fluid boundary boundary-layer control in general F15D
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: F28F 9/26 Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators connecting different sections in water heaters F24H9/14 , connecting headers with inlet or outlet fittings F28F9/0246
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/46 involving the transfer of heat by flowing fluids H01L23/42, H01L23/44 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20327 Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds

Abstract

A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.

Claims

1. A microprocessor assembly adapted for fluid cooling, the microprocessor assembly comprising:

a substrate comprising;

a first surface; and

a second surface opposite the first surface;

a semiconductor die comprising;

a bottom surface; and

a top surface opposite the bottom surface, the bottom surface of the semiconductor die mounted on the first surface of the substrate;

an integrated heat spreader comprising;

an outer surface;

an inner surface; and

a perimeter sealing surface, the integrated heat spreader positioned over the semiconductor die with the perimeter sealing surface of the integrated heat spreader attached to the first surface of the substrate;

a first layer of thermal interface material on the top surface of the semiconductor die and extending from the top surface of the semiconductor die to the inner surface of the integrated heat spreader;

a second layer of thermal interface material on the outer surface of the integrated heat spreader;

a thermally conductive base member comprising;

a first surface to be cooled; and

a second side opposite the first surface to be cooled, the second side of the thermally conductive base member being adjacent to the second layer of thermal interface material on the integrated heat spreader; and

a heat sink module comprising a bottom surface sealed against the surface to be cooled of the thermally conductive base member, the heat sink module further comprising;

an inlet port fluidly connected to an inlet chamber;

a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber; and

an outlet port fluidly connected to the outlet chamber, wherein a portion of the surface to be cooled serves as a bounding surface of the outlet chamber, and the plurality of orifices are configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the surface to be cooled of the thermally conductive base member when pressurized coolant is provided to the inlet chamber.

2. The microprocessor assembly of claim 1, wherein the plurality of orifices have an average diameter of about 0.001-0.01, 0.005-0.025, 0.015-0.035, 0.025-0.050, 0.035-0.05, 0.04-0.06, 0.05-0.08, 0.07-0.1, 0.08-0.12, 0.1-0.15, 0.14-0.18, 0.16-0.2, or 0.04 in.

3. The microprocessor assembly of claim 2, wherein the plurality of orifices comprises at least 10, 20, 30, 40, 50, or 60 orifices.

4. The microprocessor assembly of claim 1, wherein the plurality of orifices have an average jet height of about 0.01-0.75, 0.05-0.5, 0.05-0.25, 0.020-0.25, 0.03-0.125, or 0.04-0.08 in., wherein jet height for each orifice is measured as a shortest distance from an exit of the orifice to a surface to be cooled of the thermally conductive base member.

5. The microprocessor assembly of claim 1, wherein the plurality of orifices have an average diameter of D and an average length of L, and wherein L divided by D is greater than or equal to one or about 1-10, 1-8, 1-6, 1-4, or 1-3.

6. The microprocessor assembly of claim 1, wherein the semiconductor die comprises an integrated circuit with a three-dimensional circuit architecture.

7. The microprocessor assembly of claim 1, further comprising a vapor quality sensor mounted to the heat sink module, wherein the vapor quality sensor is configured to output a signal correlating to vapor quality of coolant flowing through the outlet port of the heat sink module when pressurized coolant is provided to the inlet chamber.

8. A microprocessor assembly adapted for fluid cooling, the microprocessor assembly comprising:

a substrate comprising;

a first surface; and

a second surface opposite the first surface;

a semiconductor die comprising;

a bottom surface; and

a top surface opposite the bottom surface, the bottom surface of the semiconductor die mounted on the first surface of the substrate;

an integrated heat spreader comprising;

an outer surface;

an inner surface; and

a perimeter sealing surface, the integrated heat spreader positioned over the semiconductor die with the perimeter sealing surface of the integrated heat spreader attached to the first surface of the substrate;

a layer of thermal interface material on the top surface of the semiconductor die and extending from the top surface of the semiconductor die to the inner surface of the integrated heat spreader; and

a heat sink module comprising a bottom surface sealed against the outer surface of the integrated heat spreader, the heat sink module further comprising;

an inlet port fluidly connected to an inlet chamber;

a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber; and

an outlet port fluidly connected to the outlet chamber, wherein a portion of the outer surface of the integrated heat spreader serves as a bounding surface of the outlet chamber, and the plurality of orifices are configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the outer surface of the integrated heat spreader when pressurized coolant is provided to the inlet chamber.

9. The microprocessor assembly of claim 8, further comprising a layer of adhesive between the bottom surface of the heat sink module and the outer surface of the integrated heat spreader to provide a liquid-tight seal around a perimeter of the outlet chamber of the heat sink module.

10. The microprocessor assembly of claim 8, further comprising a sealing member compressed between the bottom surface of the heat sink module and the outer surface of the integrated heat spreader to provide a liquid-tight seal around a perimeter of the outlet chamber of the heat sink module.

11. The microprocessor assembly of claim 8, wherein each orifice of the plurality of orifices comprises a central axis, the central axis oriented at an angle with respect to the outer surface of the integrated heat spreader, the angle defining a jet angle, wherein an average jet angle for the plurality of orifices is about 20-90, 30-60, 40-50, or 45 degrees with respect to the outer surface of the integrated heat spreader.

12. The microprocessor assembly of claim 8, wherein the plurality of orifices have an average jet height of about 0.01-0.75, 0.05-0.5, 0.05-0.25, 0.020-0.25, 0.03-0.125, or 0.04-0.08 in., wherein jet height for each orifice is measured as a shortest distance from an exit of the orifice to the outer surface of the integrated heat spreader.

13. The microprocessor assembly of claim 8, wherein each of the plurality of orifices is configured to provide a jet stream of coolant with a momentum flux of about 24-220, 98-390, 220-611, 390-880, 611-1200, 880-1566, or greater than 1566 kg/m-s² when pressurized coolant is provided to the inlet chamber at a pressure of about 10-30, 15-40, 30-60, or 50-75 psi.

14. The microprocessor assembly of claim 8, wherein the plurality of orifices have an average diameter of about 0.001-0.01, 0.005-0.025, 0.015-0.035, 0.025-0.050, 0.035-0.05, 0.04-0.06, 0.05-0.08, 0.07-0.1, 0.08-0.12, 0.1-0.15, 0.14-0.18, 0.16-0.2, or 0.04 in.

15. A microprocessor assembly adapted for direct-to-die fluid cooling, the microprocessor assembly comprising:

a substrate comprising;

a first surface; and

a second surface opposite the first surface;

a semiconductor die comprising;

a bottom surface; and

a top surface opposite the bottom surface, the bottom surface of the semiconductor die mounted on the first surface of the substrate;

a heat sink module comprising a bottom surface sealed against the first surface of the substrate and over the semiconductor die, the heat sink module further comprising;

an inlet port fluidly connected to an inlet chamber;

a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber; and

an outlet port fluidly connected to the outlet chamber, wherein a portion of the first surface of the substrate serves as a bounding surface of the outlet chamber, wherein the semiconductor die is positioned within the outlet chamber of the heat sink module, and the plurality of orifices are configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the semiconductor die when pressurized coolant is provided to the inlet chamber.

16. The microprocessor assembly of claim 15, further comprising a layer of adhesive or a sealing member between the bottom surface of the heat sink module and the first surface of the substrate to provide a liquid-tight seal around a perimeter of the outlet chamber of the heat sink module.

17. The microprocessor assembly of claim 15, wherein the semiconductor die comprises an integrated circuit with a three-dimensional circuit architecture.

18. The microprocessor assembly of claim 15, wherein the plurality of orifices have an average jet height of about 0.01-0.75, 0.05-0.5, 0.05-0.25, 0.020-0.25, 0.03-0.125, or 0.04-0.08 in., wherein jet height for each orifice is measured as a shortest distance from an exit of the orifice to the first surface of the substrate.

19. The microprocessor assembly of claim 15, wherein the inlet chamber has a volume of about 0.002-0.5, 0.04-0.4, 0.06-0.3, 0.08-0.2, or 0.1 cubic inches, and wherein the outlet chamber has a volume of about 0.002-0.5, 0.04-0.4, 0.06-0.3, 0.08-0.2, or 0.1 cubic inches.

20. The microprocessor assembly of claim 15, wherein the plurality of orifices have an average diameter of about 0.001-0.01, 0.005-0.025, 0.015-0.035, 0.025-0.050, 0.035-0.05, 0.04-0.06, 0.05-0.08, 0.07-0.1, 0.08-0.12, 0.1-0.15, 0.14-0.18, 0.16-0.2, or 0.04 in., and wherein each orifice of the plurality of orifices comprises a central axis, the central axis oriented at an angle with respect to the first surface of the substrate, the angle defining a jet angle, wherein an average jet angle for the plurality of orifices is about 20-90, 30-60, 40-50, or 45 degrees with respect to the first surface of the substrate.