COMPOUND SPRING MEMS RESONATORS FOR FREQUENCY AND TIMING GENERATION

• US 20160118954A1
• Filed: 10/14/2015
• Published: 04/28/2016
• Est. Priority Date: 10/22/2014
• Status: Active Grant

• Current Assignee: Microchip Technology Incorporated
• Original Assignee: Micrel Incorporated (Microchip Technology Incorporated)
• Inventors: Clark, John Ryan
• Granted Patent: US 9,923,545 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H02N 1/008 Laterally driven motors, e.g. of the comb-drive type
• CPC Class Codes: H03H 2009/02251 Design
• CPC Class Codes: H03H 2009/02283 Vibrating means
• CPC Class Codes: H03H 2009/02307 Dog-bone-like structure, i.e. the elongated part of the "bone" is doubly clamped
• CPC Class Codes: H03H 2009/0233 comprising perforations
• CPC Class Codes: H03H 2009/02496 Horizontal, i.e. parallel to the substrate plane
• CPC Class Codes: H03H 9/02244 of microelectro-mechanical resonators
• CPC Class Codes: H03H 9/2405 of microelectro-mechanical resonators
• CPC Class Codes: H03H 9/2431 Ring resonators
• CPC Class Codes: H03H 9/2452 Free-free beam resonators

Abstract

A compound spring MEMS resonator includes a resonator body constructed using one or more spring unit cells forming a compound spring block and one or more compound spring blocks forming the resonator body. Each compound spring block is anchored at nodal points to ensure a high quality factor. The resonator body further includes masses attached to the open ends of the compound spring block and capacitively coupled to drive/sense electrodes. The dimensions of the spring unit cells, the number of spring unit cells for a compound spring block, the size and weight of the masses, and the length and width of the support beams are selected to realize a desired resonant frequency. Meanwhile, the number of compound spring blocks is selected to tune the desired electrical characteristics, such as impedance, of the MEMS resonator.

Claims

1. A MEMS resonator comprising:

a resonator body comprising a first spring-mass section and a second spring-mass section, each spring-mass section comprising a compound spring structure having a base end and an open end and a mass attached to the open end of the compound spring structure, the first and second spring-mass sections being connected at the base ends which form a pair of nodal points of minimum movement of the resonator body during resonant vibration of the resonator body, wherein the compound spring structure is formed from one or more spring unit cells and each spring unit cell comprises a folded spring structure;

a pair of anchors connected to a substrate and attached to opposite sides of the resonator body at the nodal points;

a drive electrode formed attached to the substrate and capacitively coupled to the mass of the first spring-mass section; and

a sense electrode formed attached to the substrate and capacitively coupled to the mass of the second spring-mass section.

2. The MEMS resonator of claim 1, further comprising:

a pair of suspension beams suspended above the substrate, each anchor being attached to the resonator body at the nodal point through one of the suspension beams.

3. The MEMS resonator of claim 1, wherein the drive electrode and the mass of the first spring-mass section is separated by a first gap and the sense electrode and the mass of the second spring-mass section is separated by a second gap, each of the first and second gaps being equal to or less than 1 μ

m.

4. The MEMS resonator of claim 1, wherein the resonator body has a thickness of 20-30 μ

m.

5. The MEMS resonator of claim 1, wherein the resonator body is formed from a material selected from a single crystalline silicon layer and a polycrystalline silicon layer.

6. The MEMS resonator of claim 1, wherein the substrate comprises a silicon base layer on which an insulating layer is formed.

7. The MEMS resonator of claim 1, wherein the spring unit cell comprises a rectangular folded spring structure.

8. The MEMS resonator of claim 1, wherein the mass attached to the open end of the compound spring structure in each spring-mass section comprises release holes formed therein, the release holes adjusting the weight of the mass.

9. The MEMS resonator of claim 1, wherein dimensions of the spring unit cell, including the dimensions of beams forming the folded spring structure, a number of spring unit cells in the compound spring structure and a size and a weight of the mass in each spring-mass section are selected to tune a resonant frequency of the MEMS resonator.

10. A MEMS resonator comprising:

a resonator body comprising one or more resonator units, each resonator unit comprising;

a first spring-mass section and a second spring-mass section, each spring-mass section comprising a compound spring structure having a base end and an open end and a mass attached to the open end of the compound spring structure, the first and second spring-mass sections being connected at the base ends which form a pair of nodal points of minimum movement of the resonator unit during resonant vibration of the resonator unit, wherein the compound spring structure is formed from one or more spring unit cells and each spring unit cell comprises a folded spring structure; and

a pair of anchors connected to a substrate and attached to opposite sides of the resonator unit at the nodal points,

wherein the masses of the first spring-mass sections of the one or more resonator units are formed as a continuous structure to form a first mass, and the masses of the second spring-mass sections of the one or more resonator units are formed as a continuous structure to form a second mass, the first mass and the second mass being formed to connect the resonator units in parallel;

a drive electrode formed attached to the substrate and capacitively coupled to the first mass; and

a sense electrode formed attached to the substrate and capacitively coupled to the second mass.

11. The MEMS resonator of claim 10, wherein each resonator unit further comprises:

a pair of suspension beams suspended above the substrate, each anchor being attached to the resonator unit at the nodal point through one of the suspension beams.

12. The MEMS resonator of claim 10, wherein the drive electrode and the first mass is separated by a first gap and the sense electrode and the second mass is separated by a second gap, each of the first and second gaps being equal to or less than 1 μ

m.

13. The MEMS resonator of claim 10, wherein the resonator body has a thickness of 20-30 μ

m.

14. The MEMS resonator of claim 10, wherein the resonator body is formed from a material selected from a single crystalline silicon layer and a polycrystalline silicon layer.

15. The MEMS resonator of claim 10, wherein the substrate comprises a silicon base layer on which an insulating layer is formed.

16. The MEMS resonator of claim 10, wherein the spring unit cell comprises a rectangular folded spring structure.

17. The MEMS resonator of claim 10, wherein the first mass and the second mass each comprises release holes formed therein, the release holes adjusting the weight of the first or second mass.

18. The MEMS resonator of claim 10, wherein dimensions of the spring unit cell, including the dimensions of beams forming the folded spring structure, a number of spring unit cells in the compound spring structure and a size and a weight of the mass in each spring-mass section are selected to tune a resonant frequency of the MEMS resonator.

19. The MEMS resonator of claim 10, wherein a number of resonant units in the resonator body is selected to obtain a desired electrical characteristic of the MEMS resonator.

20. The MEMS resonator of claim 19, wherein the number of resonant units in the resonator body is selected to obtain a desired motional impedance of the MEMS resonator.