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APPARATUS AND METHOD FOR CUTTING SEMI/NON-CONDUCTOR USING WEDM

  • US 20160121415A1
  • Filed: 07/07/2015
  • Published: 05/05/2016
  • Est. Priority Date: 11/05/2014
  • Status: Abandoned Application
First Claim
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1. A wire electrical discharge machining (WEDM) method, the WEDM method comprising steps of:

  • (a) providing one of a non-conductive and a weakly conductive objects having a to-he-cut surface;

    (b) providing one of a wire and a cutting tool having a cutting blade edge to cut the object along the to-be-cut surface;

    (c) providing a conductive medium to be adhered to the to-be-cut surface via the cutting blade edge; and

    (d) applying an electric current between the one of the wire and the cutting tool, and the to-be-cut surface adhered with the conductive medium such that the to-be-cut surface is melted.

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