OPTOELECTRONIC BALL GRID ARRAY PACKAGE WITH FIBER
First Claim
Patent Images
1. An apparatus, comprising:
- a substrate having a first surface;
a photonic integrated circuit (PIC) coupled to the substrate and having a first surface proximate the first surface of the substrate and a second surface opposite the first surface of the PIC and distal the first surface of the substrate;
a lid, contacting the first surface of the substrate;
a fiber holder disposed on the lid; and
an optical fiber coupled to the PIC and in contact with the fiber holder.
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Accused Products
Abstract
A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.
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Citations
24 Claims
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1. An apparatus, comprising:
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a substrate having a first surface; a photonic integrated circuit (PIC) coupled to the substrate and having a first surface proximate the first surface of the substrate and a second surface opposite the first surface of the PIC and distal the first surface of the substrate; a lid, contacting the first surface of the substrate; a fiber holder disposed on the lid; and an optical fiber coupled to the PIC and in contact with the fiber holder. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method, comprising:
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packaging a photonic integrated circuit (PIC) in a package comprising a substrate and a lid; mounting a fiber holder on the lid of the package such that the lid is between the PIC and the fiber holder; coupling an optical fiber to the PIC; mechanically coupling the optical fiber to the fiber holder. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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21. An apparatus, comprising:
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a substrate having a first surface; a photonic integrated circuit (PIC) coupled to the substrate and having a first surface proximate the first surface of the substrate and a second surface opposite the first surface of the PIC and distal the first surface of the substrate; a lid, contacting the first surface of the substrate and at least partially covering the PIC, exhibiting at least one retaining feature; and an optical fiber coupled to the PIC and in contact with the retaining feature of the lid. - View Dependent Claims (22, 23, 24)
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Specification