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OPTICAL CONNECTION TECHNIQUES AND CONFIGURATIONS

  • US 20160124166A1
  • Filed: 01/11/2016
  • Published: 05/05/2016
  • Est. Priority Date: 11/16/2011
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • depositing solder interconnect material to facilitate attachment of components to a surface of a package substrate;

    positioning the components for attachment to the package substrate, the components including at leastan optoelectronic assembly configured to emit and/or receive optical signals in the form of light for a processor, the optoelectronic assembly having one or more optical apertures that emit and/or receive the light in a direction that is substantially perpendicular to the surface of the package substrate, anda receptacle having a pluggable surface to receive an optical coupler plug such that an optical coupler plug is optically aligned to route the light to or from the one or more optical apertures of the optoelectronic assembly when theoptical coupler plug is plugged into the receptacle; and

    reflowing the deposited solder interconnect material to form a bond between the components and the package substrate.

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