Analysis of Stimulus by RFID

• US 20160125282A1
• Filed: 01/14/2016
• Published: 05/05/2016
• Est. Priority Date: 11/26/2012
• Status: Abandoned Application

• Current Assignee: US Photonics, Inc.
• Original Assignee: US Photonics, Inc.
• Inventors: Conner, Jacob, Giedd, Ryan
• Application Number:
  US14/996,207
• Publication Number:
  US 20160125282A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01L 1/14 by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
• CPC Class Codes: G01L 1/142 using capacitors
• CPC Class Codes: G01N 19/10 Measuring moisture content, e.g. by measuring change in length of hygroscopic filament; Hygrometers
• CPC Class Codes: G01R 19/0007 Frequency selective voltage or current level measuring measuring frequency G01R23/00; testing attenuation in line transmission systems H04B3/48; monitoring testing in transmission systems H04B17/00
• CPC Class Codes: G01R 23/02 Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage
• CPC Class Codes: G01R 27/32 in circuits having distributed constants , e.g. having very long conductors or involving high frequencies
• CPC Class Codes: G01R 31/2872 related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
• CPC Class Codes: G06K 19/0717 the sensor being capable of sensing environmental conditions such as temperature history or pressure
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07788 the antenna being of the capacitive type
• CPC Class Codes: G06K 19/0779 the antenna being foldable or folded

Abstract

The present invention is directed to a process for manufacturing a capacitor for an RFID device. The process utilizes stencils to spray-coat capacitor electrodes about a substrate, and in other embodiments, the process spray coats a first capacitor on a substrate, then an insulator on the first capacitor, and then a second capacitor on the insulator.

Claims

1. A process for manufacturing a capacitor for an RFID device, said process comprising:

positioning a first electrode stencil, proximate to an insulated RFID substrate, having a first electrode void with a substantially two-dimensional representation of a predetermined capacitor first electrode area;

spray-coating at least one first electrode layer on said substrate through said void to form a first electrode occupying less than 25% of a surface area of said substrate;

applying a second electrode stencil, proximate to said RFID substrate, having a second electrode void with a substantially two-dimensional representation of a predetermined capacitor second electrode area; and

spray-coating at least one second electrode layer on said substrate through said second electrode void, concentric with and opposite of said first electrode, to form a second electrode of surface area approximately equal to said first electrode to fabricate a capacitor as a first circuit component; and

affixing a second circuit component on said substrate in electrical communication with said capacitor via a conductor affixed to said substrate.

2. The process of claim 1 wherein said positioning step includes positioning said first electrode stencil having a first electrode void with said substantially two-dimensional representation of said predetermined capacitor first electrode area and a first capacitor lead.

3. The process of claim 1 wherein said applying step includes applying said second electrode stencil having said second electrode void with said substantially two-dimensional representation of said predetermined capacitor second electrode area and a second capacitor lead.

4. The process of claim 1 wherein said applying step includes applying said second electrode stencil having said second electrode void with a substantially two-dimensional representation of said predetermined capacitor second electrode area and a second capacitor lead.

5. The process of claim 4 wherein said positioning step includes positioning said first electrode stencil having said first electrode void with said substantially two-dimensional representation of said predetermined capacitor first electrode area and a first capacitor lead.

6. An RFID circuit comprising:

an insulated substrate, having an upper surface and lower surface bearing a conductive trace;

a first electrode affixed to said upper surface of said substrate in electrical communication with said conductive trace;

a second electrode affixed to said lower surface of said substrate, concentric with and opposite of said first electrode, in electrical communication with said conductive trace, wherein said first electrode, second electrode, and said substrate constitute a capacitor;

a circuit component affixed to said substrate and joined to said conductive trace.

7. The RFID circuit of claim 6 wherein said first electrode occupies less than 25% of said upper surface of said substrate.