SEALING TAG WITH CONDUCTIVE FEATURES FOR PREVENTING THE COUNTERFEITING OF A PRODUCT AND A METHOD FOR MANUFACTURING SUCH
First Claim
1. A sealing tag with conductive features, containing at least one conductive marking, pattern or surface, whereineach conductive marking, pattern, or surface (3) and a substrate material (1) are interconnected by an adhesive pattern (2) or other bond,characterized in thatthe size and shape of said adhesive pattern (2) or other bond matches the main outlines of the conducting circuit pattern (3) such that inside the area limited by the main outlines there is at least one area (2a) where the adhesion is strong and at least one area (2b) where the adhesion is weak.
1 Assignment
0 Petitions
Accused Products
Abstract
A sealing tag with conductive features, containing at least one conductive marking, pattern or surface, wherein each conductive marking, pattern, or surface and a substrate material are interconnected by an adhesive pattern or other bond. The sealing tag is characterized in that the size and shape of the adhesive pattern or other bond matches the main outlines of the conducting circuit pattern such that inside the area limited by the main outlines there is at least one area where the adhesion is strong and at least one area where the adhesion is weak. Additionally, a method for manufacturing such sealing tag is disclosed.
10 Citations
14 Claims
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1. A sealing tag with conductive features, containing at least one conductive marking, pattern or surface, wherein
each conductive marking, pattern, or surface (3) and a substrate material (1) are interconnected by an adhesive pattern (2) or other bond, characterized in that the size and shape of said adhesive pattern (2) or other bond matches the main outlines of the conducting circuit pattern (3) such that inside the area limited by the main outlines there is at least one area (2a) where the adhesion is strong and at least one area (2b) where the adhesion is weak.
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10. A method for manufacturing a sealing tag with conductive features, including the following steps of:
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i) affixing a conductive layer (3) to a substrate material (1) by means of a bond (2) and leaving the removal-intended more extensive areas unattached to the substrate material (1); and ii) removing the removable areas from the conductive layer; characterized in that further a part of the conductive layer (3) is left with less adhesion in step i) but not removed in step ii) leaving on the sealing tag a part (3b) of the conductive marking, pattern or surface (3) that is not strongly affixed by means of a bond (2). - View Dependent Claims (11, 12, 13, 14)
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Specification