APPARATUS FOR DISSIPATING HEAT OF INDUCTOR

• US 20160125997A1
• Filed: 10/28/2015
• Published: 05/05/2016
• Est. Priority Date: 10/31/2014
• Status: Abandoned Application

• Current Assignee: Hyundai Mobis Co., Ltd.
• Original Assignee: Hyundai Mobis Co., Ltd.
• Inventors: HWANG, Soo Bin
• Application Number:
  US14/924,796
• Publication Number:
  US 20160125997A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 2027/065 Mounting on printed circuit boards
• CPC Class Codes: H01F 27/22 Cooling by heat conduction through solid or powdered fillings
• CPC Class Codes: H01F 37/00 Fixed inductances not covered by group H01F17/00

Abstract

Provided is an apparatus for effectively dissipating heat generated by an inductor of a DC-DC converter, and allowing for reducing a size and a weight of the DC-DC converter to thereby reduce manufacturing cost. The apparatus for dissipating heat of an inductor includes an inductor configured to protrude to outside; and a heat sink configured to be installed outside of the inductor and to receive the inductor.

Claims

1. An apparatus for dissipating heat of an inductor, the apparatus comprising:

an inductor configured to protrude to an outside; and

a heat sink configured to be installed outside of the inductor and to receive the inductor.

2. The apparatus of claim 1, further comprising:

a printed circuit board (PCB) on which the inductor is mounted; and

a housing configured to hermetically seal an internal component mounted on the PCB.

3. The apparatus of claim 2, wherein the internal component is mounted on a first surface of the PCB and the inductor is mounted on a second surface opposing the first surface of PCB.

4. The apparatus of claim 1, wherein the heat sink includes a receiving unit for receiving the inductor.

5. The apparatus of claim 4, wherein an edge of an entrance of the receiving unit is rounded with a predetermined curvature.

6. The apparatus of claim 4, wherein the edge of the entrance of the receiving unit is chamfered with a predetermined with and a predetermined slope.

7. The apparatus of claim 4, wherein a thermal grease is applied to the interior of the receiving unit.

8. The apparatus of claim 7, wherein the thermal grease is at least one of a ceramic-based thermal grease, a metal-based thermal grease, a carbon-based thermal grease, a fusible metal-based thermal grease.

9. The apparatus of claim 4, wherein a solder cream is applied between the receiving unit and the inductor.

10. The apparatus of claim 4, wherein the inductor is in contact with an inner surface of the receiving unit.