Medical Device

• US 20160128585A1
• Filed: 11/06/2015
• Published: 05/12/2016
• Est. Priority Date: 11/07/2014
• Status: Active Grant

• Current Assignee: Welch Allyn Incorporated
• Original Assignee: Welch Allyn Incorporated
• Inventors: Knieriem, Alan S.
• Granted Patent: US 10,405,758 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 2560/0204 of power management
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 2562/166 the sensor is mounted on a specially adapted printed circuit board
• CPC Class Codes: A61B 5/002 Monitoring the patient using a local or closed circuit, e.g. in a room or building A61B5/0017 takes precedence
• CPC Class Codes: A61B 5/02055 Simultaneously evaluating both cardiovascular condition and temperature
• CPC Class Codes: A61B 5/02141 Details of apparatus construction, e.g. pump units or housings therefor, cuff pressurising systems, arrangements of fluid conduits or circuits A61B5/02233, A61B5/0235 take precedence
• CPC Class Codes: A61B 5/02233 Occluders specially adapted therefor tourniquets A61B17/132
• CPC Class Codes: A61B 5/0235 Valves specially adapted therefor
• CPC Class Codes: A61B 5/7405 using sound
• CPC Class Codes: A61B 5/742 using visual displays A61B5/339 takes precedence
• CPC Class Codes: A61B 50/13 Trolleys, e.g. carts
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/13332 Front frames
• CPC Class Codes: G02F 1/133325 Assembling processes
• CPC Class Codes: H02J 7/342 The other DC source being a battery actively interacting with the first one, i.e. battery to battery charging with circuits for polarity protection H02J7/0034
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0296 Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor

Abstract

A carrier assembly includes a sub-assembly including a pump, at least one solenoid valve, and a check valve. The pump, the at least one solenoid valve, and the check valve are in fluid communication with each other and with at least one pressure transducer via a manifold. Also, the carrier assembly is configured to be mounted to a medical device'"'"'s main assembly board.

Claims

1. A carrier assembly, comprising:

a sub-assembly comprising a pump, at least one solenoid valve, and a check valve,

wherein the pump, the at least one solenoid valve and the check valve are in fluid communication with each other and with at least one pressure transducer via a manifold; and

wherein the carrier assembly is configured to be mounted to a medical device'"'"'s main assembly board.

2. The carrier assembly of claim 1, wherein the sub-assembly further comprises:

a speaker;

a Wi-Fi radio and a Bluetooth radio; and

an integrated wire harness holding at least one wire for each of;

the pump, the at least one solenoid valve, the check valve, the speaker, the Wi-Fi radio, and the Bluetooth radio.

3. The carrier assembly of claim 2, wherein the manifold is mounted to the medical device'"'"'s main assembly board, and

wherein the manifold is configured to form a fluid connection with a blood pressure cuff connector.

4. The carrier assembly of claim 3, wherein the medical device'"'"'s main assembly board has a first surface area on a top surface of the main assembly board, wherein the carrier assembly has a second surface area, and wherein the second surface area is at least less than half of the first surface area.

5. The carrier assembly of claim 1, further comprising the main assembly board, wherein the main assembly board includes a printed circuit board.

6. The carrier assembly of claim 5, wherein the sub-assembly is carried on the printed circuit board.

7. The carrier assembly of claim 6, wherein the sub-assembly and the printed circuit board form an integrated assembly.

8. A blood pressure module, comprising:

a main printed circuit assembly;

a manifold positioned on the main printed circuit assembly;

at least one pressure transducer positioned on the main printed circuit assembly; and

a sub-assembly, comprising;

a pump;

at least one solenoid valve positioned adjacent to the pump; and

a check valve positioned adjacent to both the pump and the at least one solenoid valve,

wherein the pump, the at least one solenoid valve and the check valve are in fluid communication with each other and with the at least one pressure transducer via the manifold; and

wherein the sub-assembly is configured to be mounted to a medical device'"'"'s main assembly board.

9. The blood pressure module of claim 8, wherein the sub-assembly further comprises:

a speaker;

a Wi-Fi radio and a Bluetooth radio; and

an integrated wire harness holding at least one wire for each of;

the pump, the at least one solenoid valve, the check valve, the speaker, the Wi-Fi radio, and the Bluetooth radio.

10. The blood pressure module of claim 8, wherein the medical device'"'"'s main assembly board has a first surface area on a top surface of the main assembly board, wherein the sub-assembly has a second surface area, and wherein the second surface area is at least less than half of the first surface area.

11. The blood pressure module of claim 8, wherein the main assembly board includes a printed circuit board.

12. The blood pressure module of claim 11, wherein the sub-assembly is carried on the printed circuit board.

13. The blood pressure module of claim 12, wherein the sub-assembly and the printed circuit board form an integrated assembly.

14. A method of forming a carrier assembly for a medical device, the method comprising:

forming a sub-assembly comprising a pump, at least one solenoid valve, and a check valve,

placing the pump, the at least one solenoid valve and the check valve in fluid communication with each other and with at least one pressure transducer via a manifold; and

mounting the sub-assembly is configured to be mounted to a medical device'"'"'s main assembly board.

15. The method of claim 14, wherein the sub-assembly further comprises:

a speaker;

a Wi-Fi radio and a Bluetooth radio; and

an integrated wire harness holding at least one wire for each of;

the pump, the at least one solenoid valve, the check valve, the speaker, the Wi-Fi radio, and the Bluetooth radio.

16. The method of claim 15, further comprising

mounting the manifold to the medical device'"'"'s main assembly board, and

forming a fluid connection between the manifold and a blood pressure cuff connector.

17. The method of claim 14, wherein the medical device'"'"'s main assembly board has a first surface area on a top surface of the main assembly board, wherein the carrier assembly has a second surface area, and wherein the second surface area is at least less than half of the first surface area.

18. The method of claim 14, wherein the main assembly board includes a printed circuit board.

19. The method of claim 18, further comprising carrying the sub-assembly on the printed circuit board.

20. The method of claim 19, wherein the sub-assembly and the printed circuit board form an integrated assembly.