Load Transient , Reduced Bond Wires for Circuits Supplying Large Currents

• US 20160132064A1
• Filed: 01/15/2016
• Published: 05/12/2016
• Est. Priority Date: 10/16/2012
• Status: Active Grant

• Current Assignee: Dialog Semiconductor GmbH (Renesas Electronics Corporation)
• Original Assignee: Dialog Semiconductor GmbH (Renesas Electronics Corporation)
• Inventors: Bhattad, Ambreesh, Nikolov, Ludmil
• Granted Patent: US 9,454,170 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G05F 1/575 characterised by the feedback circuit

Abstract

Circuits and methods to improve dynamic load transient performance of circuits supplying high current and having parasitic resistances are disclosed. These circuits comprise e.g. LDOs, amplifiers or buffers. The circuits and methods are characterized by including parasitic resistances, caused by bond wires, metallization of pass devices, and substrate routings, in a loop for fast transient response. Furthermore the circuits comprise a stabilization circuit within said loop and a separate pad for said loop.

Claims

1. A method to improve dynamic load transient performance of circuits supplying high current, comprising the following steps:

(1) providing an electronic circuit supplying high currents and having parasitic resistances and a differential error amplifier, wherein said parasitic resistances comprise resistances of one or more bond wires, metallization of one or more pass devices, and substrate routings;

(2) including parasitic resistances in a separate loop for fast loop response, wherein the separate loop for fast loop response is connected between an output of the differential error amplifier and a separate pad connected to feedback voltage divider VFB;

(3) implementing a stabilizing circuit within said fast loop response, wherein the stabilization circuit is achieved by splitting a main pass device into two unequal parts, namely a smaller part of the pass device and a larger part of the pass device and by placing a controlled impedance in series with the smaller part of the main pass device and including this controlled impedance to the parasitic resistances of the fast loop response; and

(4) deploying the separate pad for the fast loop response directly connected to feedback voltage divider VFB.

2. The method of claim 1 wherein said high current comprise a range of more than 200 mA.

3. The method of claim 1 wherein said circuit is a LDO.

4. The method of claim 1 wherein said circuit is an amplifier.

5. The method of claim 1 wherein said circuit is a buffer.

6. The method of claim 1 wherein a resistance of the larger part of the main pass transistor is not included in the loop of fast response.

7. The method of claim 1 wherein one bond wire is used.

8. The method of claim 1 wherein more than one bond wire are used.

17. The circuit of claim 8 wherein the stabilizing circuit comprises a main pass transistor and an additional pass transistor in parallel to the main pass transistor.

18. The circuit of claim 17 wherein a resistive device, having a resistance in a range between about 0.5 to 10 Ω

, is deployed between a drain of the additional pass transistor and an output of the circuit.

19. The circuit of claim 18 wherein the resistive device is a resistor.

9. A circuit to improve dynamic load transient performance of circuits supplying high current and having parasitic resistances, comprising:

a differential error amplifier, having inputs and an output, wherein a first input is a reference voltage and a second input is a feedback voltage from a middle node of a voltage divider and the output is connected to gates of pass transistors;

said voltage divider connected between an entry point of the voltage divider via bond resistances to an output voltage of the circuit and ground;

a separate loop for fast transient response including the parasitic resistances wherein the separate loop for fast loop response is connected between an output of the differential error amplifier and a separate pad directly connected to an entry point of the voltage divider, wherein said parasitic resistances comprise resistances of one or more bond wires, metallization of one or more pass devices, and substrate routings;

said separate pad for the loop for fast transient response; and

a stabilizing circuit connected to said loop for fast transient response, wherein the stabilization circuit is achieved by splitting a main pass device into two unequal parts, namely a smaller part of the pass device and a larger part of the pass device and by placing a controlled impedance in series with the smaller part of the main pass device and including this controlled impedance to the parasitic resistances of the fast loop response.

10. The circuit of claim 9 wherein said circuit is an LDO.

11. The circuit of claim 9 wherein said circuit is an amplifier.

12. The circuit of claim 9 wherein said circuit is a buffer.

13. The circuit of claim 9 wherein the circuit comprises one bond wire.

14. The circuit of claim 9 wherein the circuit comprises more than one bond wire.

15. The circuit of claim 9 wherein said high current comprise a range of more than 200 mA.

16. The circuit of claim 9 wherein said loop for fast transient response comprises a capacitor.