Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same

• US 20160133602A1
• Filed: 01/18/2016
• Published: 05/12/2016
• Est. Priority Date: 12/11/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chen, Kim Hong, Hung, Wensen, Huang, Szu-Po, Jeng, Shin-Puu
• Granted Patent: US 9,595,506 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2023/4056 heatsink to additional heatsink
• CPC Class Codes: H01L 2023/4062 heatsink to or through board or cabinet
• CPC Class Codes: H01L 2023/4068 Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2225/06582 Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA

Abstract

An embodiment package includes a first die stack on a surface of a package component, a second die stack on the surface of the package component, and a contour lid over the first die stack and second die stack. The contour lid includes a first thermal conductive portion over the first die stack, a second thermal conductive portion over the second die stack, and a thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion. The thermal barrier portion includes a low thermal conductivity material.

Claims

1. A package comprising:

a first die bonded to a substrate;

a second die adjacent the first die and bonded to the substrate;

a contour lid over the first die; and

a heat spreader comprising;

a first portion over the first die, wherein the contour lid is disposed between the first portion and the first die; and

a second portion extending beneath a top surface of the contour lid and directly attach to the second die.

2. The package of claim 1, wherein the heat spreader further comprises a thermal barrier disposed between the first portion and the second portion.

3. The package of claim 2, wherein thermal barrier comprises a low thermal conductivity material having a thermal conductivity less than about 0.05 watts per meter kelvin, one or more air gaps, or a combination thereof.

4. The package of claim 3, wherein the thermal barrier comprises a plurality of through-holes extending through the heat spreader, wherein high thermal conductivity material having a thermal conductivity greater than the low thermal conductivity material is disposed between each of the plurality of through-holes.

5. The package of claim 3, wherein the thermal barrier comprises a continuous trench extending continuously from between opposing sides of the first die in a top down view.

6. The package of claim 1, wherein the first die has a first height, and wherein the second die has a second height different than the first height.

7. The package of claim 1 further comprising a first thermal interface material (TIM) and a second TIM physically separated from the first TIM, wherein the first TIM attaches the first portion of the heat spreader to the contour lid, and wherein the second TIM attaches the second portion of the heat spreader to the second die.

8. A package comprising:

a first die bonded to a surface of a package component;

a second die adjacent the first die; and

a lid over the first die and second die, wherein the lid comprises;

a first thermal conductive portion;

a second thermal conductive portion; and

a first thermal barrier contacting a first sidewall of the first thermal conductive portion and a second sidewall of the second thermal conductive portion, wherein the first thermal barrier comprises a different material than that first thermal conductive portion and the second thermal conductive portion, and wherein the first thermal barrier is disposed directly over a spacing between the first die and the second die.

9. The package of claim 8, further comprising a first thermal interface material (TIM) on a top surface of the first die and a second TIM on a top surface of the second die, wherein first TIM attaches the first thermal conductive portion to the first die, and wherein second TIM attaches the second thermal conductive portion to the second die.

10. The package of claim 9, wherein the first TIM does not contact the second TIM.

11. The package of claim 8, wherein the first thermal barrier comprises an epoxy, an unsaturated polyester, a phenolic, an adhesive, or a combination thereof.

12. The package of claim 8, wherein the first thermal barrier comprises one or more through holes.

13. The package of claim 8, wherein the first thermal barrier comprises a trench.

14. The package of claim 8 further comprising an air gap between the first thermal conductive portion and the second thermal conductive portion.

15. The package of claim 8, further comprising a composite heat spreader over the lid, wherein the composite heat spreader comprises:

a third thermal conductive portion over the first thermal conductive portion;

a fourth thermal conductive portion over the second thermal conductive portion; and

a second thermal barrier between the third thermal conductive portion and the fourth thermal conductive portion, wherein the second thermal barrier comprises a different material than the third thermal conductive portion and the fourth thermal conductive portion.

16. A method comprising:

bonding a first die to a substrate;

bonding a second die to the substrate and adjacent the first die;

attaching a contour lid over the first die and the second die, wherein the contour lid comprises;

a first thermal conductive portion over the first die;

a second thermal conductive portion over the second die; and

a first thermal barrier contacting the first thermal conductive portion and the second thermal conductive portion, wherein the first thermal barrier comprises a different material than the first thermal conductive portion and the second thermal conductive portion.

17. The method of claim 16, wherein the first thermal barrier comprises a plurality of through-holes extending through the contour lid, wherein a low thermal conductivity material of the first thermal barrier is disposed within the plurality of through-holes.

18. The method of claim 16, wherein attaching the contour lid comprises:

attaching the first thermal conductive portion to the first die using a first thermal interface material (TIM); and

attaching the second thermal conductive portion to the second die using a second TIM physically separated from the first TIM.

19. The method of claim 16, wherein the first thermal barrier comprises an epoxy, an unsaturated polyester, a phenolic, an adhesive, or a combination thereof.

20. The method of claim 16 further comprising attaching a composite heat spreader over the contour lid, wherein the composite heat spreader comprises:

a third thermal conductive portion over the first thermal conductive portion;

a fourth thermal conductive portion over the second thermal conductive portion; and

a second thermal barrier between the third thermal conductive portion and the fourth thermal conductive portion, wherein the second thermal barrier comprises a different material than the third thermal conductive portion and the fourth thermal conductive portion.