ALUMINUM OXIDE LANDING LAYER FOR CONDUCTIVE CHANNELS FOR A THREE DIMENSIONAL CIRCUIT DEVICE
First Claim
1. A circuit device comprising:
- a multitier stack of memory cells, each tier of the stack including a memory cell device;
a source gate select polycrystalline (SGS poly) layer adjacent the multitier stack of memory cells, the SGS poly layer to provide a gate select signal for the memory cells of the multitier stack;
a conductive source layer to provide a source conductor for a channel for the tiers of the stack; and
an aluminum oxide (AlOx) layer between the source layer and the SGS poly layer, the AlOx layer providing an etch stop layer to separate the SGS poly layer from the source layer, wherein the AlOx layer provides both dry etch selectivity and wet etch selectivity, wherein a channel etch etches through the multitier stack of memory cells and the SGS poly layer, and stops at the AlOx layer and does not expose the source layer, and wherein a selective gate etch etches gate contacts in the memory cells and etches the AlOx layer to expose the source layer.
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Accused Products
Abstract
A multitier stack of memory cells having an aluminum oxide (AlOx) layer as a noble HiK layer to provide etch stop selectivity. Each tier of the stack includes a memory cell device. The circuit includes a source gate select polycrystalline (SGS poly) layer adjacent the multitier stack of memory cells, wherein the SGS poly layer is to provide a gate select signal for the memory cells of the multitier stack. The circuit also includes a conductive source layer to provide a source conductor for a channel for the tiers of the stack. The AlOx layer is disposed between the source layer and the SGS poly layer and provides both dry etch selectivity and wet etch selectivity for creating a channel to electrically couple the memory cells to the source layer.
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Citations
20 Claims
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1. A circuit device comprising:
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a multitier stack of memory cells, each tier of the stack including a memory cell device; a source gate select polycrystalline (SGS poly) layer adjacent the multitier stack of memory cells, the SGS poly layer to provide a gate select signal for the memory cells of the multitier stack; a conductive source layer to provide a source conductor for a channel for the tiers of the stack; and an aluminum oxide (AlOx) layer between the source layer and the SGS poly layer, the AlOx layer providing an etch stop layer to separate the SGS poly layer from the source layer, wherein the AlOx layer provides both dry etch selectivity and wet etch selectivity, wherein a channel etch etches through the multitier stack of memory cells and the SGS poly layer, and stops at the AlOx layer and does not expose the source layer, and wherein a selective gate etch etches gate contacts in the memory cells and etches the AlOx layer to expose the source layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An electronic device comprising:
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a three-dimensional stacked memory device to store data, the memory device including; a multitier stack of memory cells, each tier of the stack including a memory cell device; a source gate select polycrystalline (SGS poly) layer adjacent the multitier stack of memory cells, the SGS poly layer to provide a gate select signal for the memory cells of the multitier stack; a conductive source layer to provide a source conductor for a channel for the tiers of the stack; and an aluminum oxide (AlOx) layer between the source layer and the SGS poly layer, the AlOx layer providing an etch stop layer to separate the SGS poly layer from the source layer, wherein the AlOx layer provides both dry etch selectivity and wet etch selectivity, wherein a channel etch etches through the multitier stack of memory cells and the SGS poly layer, and stops at the AlOx layer and does not expose the source layer, and wherein a selective gate etch etches gate contacts in the memory cells and etches the AlOx layer to expose the source layer; and a high-definition display coupled to generate a display based on data stored in the memory device. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method comprising:
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generating a multitier stack of memory cells, each tier of the stack including a memory cell device; creating a source gate select polycrystalline (SGS poly) layer adjacent the multitier stack of memory cells, the SGS poly layer to provide a gate select signal for the memory cells of the multitier stack; creating a conductive source layer on a semiconductor substrate to provide a source conductor for a channel for the tiers of the stack; and creating an aluminum oxide (AlOx) layer between the source layer and the SGS poly layer, the AlOx layer providing an etch stop layer to separate the SGS poly layer from the source layer, wherein the AlOx layer provides both dry etch selectivity and wet etch selectivity, wherein a channel etch etches through the multitier stack of memory cells and the SGS poly layer, and stops at the AlOx layer and does not expose the source layer, and wherein a selective gate etch etches gate contacts in the memory cells and etches the AlOx layer to expose the source layer. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification