SUBSTRATE SUPPORT ASSEMBLY HAVING RAPID TEMPERATURE CONTROL
First Claim
Patent Images
1. A substrate support assembly capable of holding and heating a substrate in a process chamber, the assembly comprising:
- (a) a ceramic puck comprising a substrate receiving surface and an opposing backside surface, the ceramic puck comprising (i) an electrode embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface, and (ii) a heater embedded in the ceramic puck to heat the substrate, the heater comprising first and second heater coils that are radially spaced apart;
(b) a base comprising a channel to circulate fluid therethrough, the channel comprising an inlet and terminus that are adjacent to one another so that the channel loops back upon itself; and
(c) a compliant layer bonding the ceramic puck to the base.
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Abstract
A substrate support assembly comprises a ceramic puck having a substrate receiving surface and an opposing backside surface. The ceramic puck has an electrode and a heater embedded therein. The heater comprises first and second coils that are radially spaced apart. A base of the support assembly comprises a channel to circulate fluid therethrough, the channel comprising an inlet and terminus that are adjacent to one another so that the channel loops back upon itself. A compliant layer bonds the ceramic puck to the base.
10 Citations
18 Claims
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1. A substrate support assembly capable of holding and heating a substrate in a process chamber, the assembly comprising:
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(a) a ceramic puck comprising a substrate receiving surface and an opposing backside surface, the ceramic puck comprising (i) an electrode embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface, and (ii) a heater embedded in the ceramic puck to heat the substrate, the heater comprising first and second heater coils that are radially spaced apart; (b) a base comprising a channel to circulate fluid therethrough, the channel comprising an inlet and terminus that are adjacent to one another so that the channel loops back upon itself; and (c) a compliant layer bonding the ceramic puck to the base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A substrate support assembly capable of holding and heating a substrate in a process chamber, the assembly comprising:
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(a) a ceramic puck comprising a substrate receiving surface and an opposing backside surface, the ceramic puck comprising; (i) an electrode embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (ii) a heater embedded in the ceramic puck to heat the substrate, the heater comprising first and second heater coils that are radially spaced apart; and (iii) wherein the opposing backside surface of the ceramic puck comprises a plurality of spaced apart mesas, with first mesas adjacent to an inlet of a channel and second mesas that being distal from the inlet of the channel, the first mesas being spaced apart a first distance that is smaller than a second distance between the second mesas; (b) a base comprising the channel to circulate fluid therethrough, the channel comprising an inlet and terminus that are adjacent to one another so that the channel loops back upon itself; and (c) a compliant layer bonding the ceramic puck to the base. - View Dependent Claims (16, 17, 18)
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Specification