SYSTEMS AND METHODS FOR FORMING SELECTIVE METAL ELECTRODE LAYERS FOR RESISTIVE SWITCHING MEMORIES
First Claim
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1. A method for selectively depositing a platinum layer on a substrate, comprising:
- providing an electroless deposition solution including a platinum precursor and at least one of water and/or a pH balancing solution;
immersing a substrate including a patterned metal layer and one or more dielectric layers in the electroless deposition solution for a first predetermined period,wherein the platinum layer is selectively deposited on the patterned metal layer but not on the one or more dielectric layers; and
removing the substrate from the electroless deposition solution after the first predetermined period.
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Abstract
A method for selectively depositing a platinum layer on a substrate includes providing an electroless deposition solution including a platinum precursor and at least one of water and/or a pH balancing solution. A substrate including a patterned metal layer and one or more dielectric layers is immersed in the electroless deposition solution for a first predetermined period. The platinum layer is selectively deposited on the patterned metal layer but not on the one or more dielectric layers. The substrate is removed from the electroless deposition solution after the first predetermined period.
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16 Claims
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1. A method for selectively depositing a platinum layer on a substrate, comprising:
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providing an electroless deposition solution including a platinum precursor and at least one of water and/or a pH balancing solution; immersing a substrate including a patterned metal layer and one or more dielectric layers in the electroless deposition solution for a first predetermined period, wherein the platinum layer is selectively deposited on the patterned metal layer but not on the one or more dielectric layers; and removing the substrate from the electroless deposition solution after the first predetermined period. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification