STACKED MICROELECTRONIC DICE EMBEDDED IN A MICROELECTRONIC SUBSTRATE
First Claim
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1. A method of forming a microelectronic device, comprising:
- attaching at least one first microelectronic die to a second microelectronic die with a plurality of interconnects;
disposing an underfill material between the at least one first microelectronic die and the second microelectronic die after attachment;
positioning a first laminate layer proximate the at least one first microelectronic die;
positioning a second laminate layer proximate the second microelectronic die; and
bringing pressure to bear on the first laminate layer and the second laminate layer to form a microelectronic substrate embedding the at least one first microelectronic die and the second microelectronic die therein.
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Abstract
Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.
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Citations
19 Claims
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1. A method of forming a microelectronic device, comprising:
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attaching at least one first microelectronic die to a second microelectronic die with a plurality of interconnects; disposing an underfill material between the at least one first microelectronic die and the second microelectronic die after attachment; positioning a first laminate layer proximate the at least one first microelectronic die; positioning a second laminate layer proximate the second microelectronic die; and bringing pressure to bear on the first laminate layer and the second laminate layer to form a microelectronic substrate embedding the at least one first microelectronic die and the second microelectronic die therein. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 16, 17)
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9. A method of forming a microelectronic device, comprising:
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disposing an underfill material on the at least one of a first microelectronic die and the second microelectronic die; attaching at least one first microelectronic die to a second microelectronic die with a plurality of interconnects extending though the underfill material; positioning a first laminate layer proximate the at least one first microelectronic die; positioning a second laminate layer proximate the second microelectronic die; and bringing pressure to bear on the first laminate layer and the second laminate layer to form a microelectronic substrate embedding the at least one first microelectronic die and the second microelectronic die therein. - View Dependent Claims (10, 11, 12, 13, 14, 15, 18, 19)
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Specification