COMPACT EMITTER FOR WARM DIMMING AND COLOR TUNABLE LAMP
First Claim
1. A substrate for an LED emitter, the substrate comprising:
- a body with a recess region formed therein;
a plurality of bonding pads disposed within the recess region, the plurality of bonding pads including a plurality of LED bonding pads and a plurality of supporting chip bonding pads;
a plurality of external electrical contacts disposed outside the recess region;
a plurality of electrical paths disposed at least partially within the body of the substrate, the electrical paths connecting the external electrical contacts to a first subset of the supporting chip bonding pads and connecting a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that a supporting chip connected to the supporting chip bonding pads is operable to deliver different operating currents to different ones of the LEDs.
1 Assignment
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Accused Products
Abstract
A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.
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Citations
22 Claims
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1. A substrate for an LED emitter, the substrate comprising:
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a body with a recess region formed therein; a plurality of bonding pads disposed within the recess region, the plurality of bonding pads including a plurality of LED bonding pads and a plurality of supporting chip bonding pads; a plurality of external electrical contacts disposed outside the recess region; a plurality of electrical paths disposed at least partially within the body of the substrate, the electrical paths connecting the external electrical contacts to a first subset of the supporting chip bonding pads and connecting a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that a supporting chip connected to the supporting chip bonding pads is operable to deliver different operating currents to different ones of the LEDs. - View Dependent Claims (2, 3, 4)
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5. An LED emitter comprising:
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a substrate having; a body with a recess region formed therein; a plurality of bonding pads disposed within the recess region, the plurality of bonding pads including a plurality of LED bonding pads and a plurality of supporting chip bonding pads; a plurality of external electrical contacts disposed outside the recess region; a plurality of electrical paths disposed at least partially within the body of the substrate, the electrical paths connecting the external electrical contacts to a first subset of the supporting chip bonding pads and connecting a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that a supporting chip connected to the supporting chip bonding pads is operable to deliver different operating currents to different ones of the LEDs; a plurality of LEDs disposed in the recess region and connected to the LED bonding pads; a controller chip disposed in the recess region and connected to the controller chip bonding pads; and an optically transparent cover disposed over the recess region. - View Dependent Claims (6, 7, 8, 9, 10, 11)
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12. A substrate for an LED emitter, the substrate comprising:
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a body with a recess region formed therein; a plurality of bonding pads disposed within the recess region, the plurality of bonding pads including a plurality of LED bonding pads, a plurality of microcontroller unit bonding pads, and a plurality of driver unit bonding pads; a plurality of external electrical contacts disposed outside the recess region; a plurality of electrical paths disposed at least partially within the body of the substrate, the electrical paths connecting the external electrical contacts to a first subset of the microcontroller unit bonding pads, connecting a second subset of the microcontroller unit bonding pads to a first subset of the driver unit bonding pads, and connecting a second subset of the driver unit bonding pads to the plurality of LED bonding pads such that a driver unit connected to the driver unit bonding pads is operable to deliver different operating currents to different ones of the LEDs in response to control signals received from the microcontroller unit. - View Dependent Claims (13, 14)
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15. An LED emitter comprising:
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a substrate having; a body with a recess region formed therein; a plurality of bonding pads disposed within the recess region, the plurality of bonding pads including a plurality of LED bonding pads, a plurality of microcontroller unit bonding pads, and a plurality of driver unit bonding pads; a plurality of external electrical contacts disposed outside the recess region; a plurality of electrical paths disposed at least partially within the body of the substrate, the electrical paths connecting the external electrical contacts to a first subset of the microcontroller unit bonding pads, connecting a second subset of the microcontroller unit bonding pads to a first subset of the driver unit bonding pads, and connecting a second subset of the driver unit bonding pads to the plurality of LED bonding pads such that a driver unit connected to the driver unit bonding pads is operable to deliver different operating currents to different ones of the LEDs in response to control signals received from the microcontroller unit; a plurality of LEDs disposed in the recess region and connected to the LED bonding pads; a microcontroller unit disposed in the recess region and connected to the microcontroller unit bonding pads; a driver unit disposed in the recess region and connected to the driver unit bonding pads; and an optically transparent cover disposed over the recess region. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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Specification