METHOD OF MANUFACTURING MICROPHONE, MICROPHONE, AND CONTROL METHOD THEREFOR

• US 20160150319A1
• Filed: 09/11/2015
• Published: 05/26/2016
• Est. Priority Date: 11/26/2014
• Status: Active Grant

• Current Assignee: Hyundai Motor Company (Hyundai Motor Group)
• Original Assignee: Hyundai Motor Company (Hyundai Motor Group)
• Inventors: YOO, Ilseon
• Granted Patent: US 9,736,605 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B81B 3/00 Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes B81B5/00 takes precedence
• CPC Class Codes: H04R 1/342 for microphones
• CPC Class Codes: H04R 1/38 in which sound waves act upon both sides of a diaphragm and incorporating acoustic phase-shifting means, e.g. pressure-gradient microphone
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2499/11 Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
• CPC Class Codes: H04R 2499/13 Acoustic transducers and sound field adaptation in vehicles
• CPC Class Codes: H04R 29/004 for microphones H04R29/007 takes precedence
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

Disclosed are a method of manufacturing a microphone, a microphone, and a control method thereof. The method includes forming a sound sensing module on a main substrate including a first sound aperture such that the sound sensing module is connected to the first sound aperture. The method further include forming a cover for receiving the sound sensing module formed therein with a second sound aperture corresponding to the first sound aperture on the main substrate. The method also includes forming a sound delay filter at a receiving space of the cover to be connected to the second sound aperture. The method also includes forming a semiconductor chip electrically connected to the sound sensing module at the receiving space, to selectively operate the sound delay filter according to a signal output from the sound sensing module.

Claims

1. A method of manufacturing a microphone, the method comprising:

forming a sound sensing module on a main substrate including a first sound aperture, such that the sound sensing module is connected to the first sound aperture;

forming a cover for receiving the sound sensing module, with a second sound aperture formed at the cover corresponding to the first sound aperture and mounted on the main substrate;

forming a sound delay filter at a receiving space of the cover to be connected to the second sound aperture; and

forming a semiconductor chip electrically connected to the sound sensing module at the receiving space and selectively operating the sound delay filter according to a signal output from the sound sensing module.

2. The method of claim 1, wherein the forming of the sound delay filter comprises:

forming sacrificial layers on a top surface and a bottom surface of a filter substrate, respectively;

forming a drive layer on the sacrificial layer on the top surface of the filter substrate;

forming a plurality of first penetration apertures by etching the drive layer;

forming a metal electrode at the etched drive layer;

forming a photoresist layer on the sacrificial layer of the bottom surface of the filter substrate;

forming a photoresist pattern by patterning the photoresist layer;

forming a plurality of second penetration apertures by etching the substrate by using the photoresist pattern as a mask; and

disposing the drive layer and the filter substrate to be spaced apart from each other by etching the sacrificial layers on a top surface and a bottom surface of a filter substrate.

3. The method of claim 2, further comprising:

upon disposing the drive layer and the filter substrate to be spaced apart from each other;

disposing a catalyst substrate on the drive layer;

forming a sacrificial layer and a photoresist pattern on the catalyst substrate;

etching the catalyst substrate by using the photoresist pattern as a mask;

depositing a catalyst on the drive layer by using the etched catalyst substrate as a mask; and

bonding a bonding material to the catalyst deposited to the drive layer.

4. The method of claim 3, wherein the bonding material is made from carbon nanotubes (CNT).

5. A microphone comprising:

a sound sensing module mounted on a surface of a main substrate with a first sound aperture formed at the main substrate, such that the sound sensing module is connected to the first sound aperture;

a cover for receiving the sound sensing module with a second sound aperture formed at the cover corresponding to the first sound aperture and mounted on the main substrate;

a sound delay filter formed at a receiving space of the cover to be connected to the second sound aperture; and

a semiconductor chip electrically connected to the sound sensing module at the receiving space and selectively operating the sound delay filter according to a signal output from the sound sensing module.

6. The microphone of claim 5, wherein the sound delay filter comprises:

a filter substrate including a first plurality of penetration apertures; and

a drive layer formed on the filter substrate to be spaced apart by a sacrificial layer, and including a second plurality of penetration apertures.

7. The microphone of claim 6, wherein the first plurality of penetration apertures and the second plurality of penetration apertures are offset from each other, and the first plurality of penetration apertures are selectively closed by the drive layer.

8. The microphone of claim 7, wherein the drive layer makes contact with the filter substrate to close the first plurality of penetration apertures when a current from the semiconductor is applied to the drive layer.

9. The microphone of claim 5, wherein the filter substrate is made of at least one of a silicon wafer and a silicon-on-insulator (SOI) wafer.

10. The microphone of claim 5, wherein the drive layer is made of at least one of silicon and polysilicon.

11. An operating method of a microphone, comprising:

operating a sound sensing module by operating a sound processor;

transmitting a sound source voltage generated from the sound sensing module to a semiconductor chip;

measuring amplitude of a noise voltage with respect to the sound source voltage input to the semiconductor chip to compare the measured noise voltage with a reference voltage preset in the semiconductor chip;

applying a current to a sound delay filter when the noise voltage is less than the reference voltage, so that a drive layer makes contact with a filter substrate to close a first plurality of penetration apertures, and to implement the microphone as a non-directional microphone.

12. The operating method of claim 11, further comprising, upon the comparing of the measured noise voltage with the reference voltage preset in the semiconductor chip, blocking supply of the current to the sound delay filter when the noise voltage is equal to or greater than the reference voltage, so that the drive layer is spaced apart from the filter substrate by a predetermined distance to open the first plurality of penetration apertures and to implement the microphone as a directional microphone.

13. The operating method of claim 11, wherein the sound processor comprises at least one of a sound recognition device, a hands free device, and a portable communication terminal.