Silicon Cooling Plate With An Integrated PCB

• US 20160150678A1
• Filed: 11/22/2015
• Published: 05/26/2016
• Est. Priority Date: 11/22/2014
• Status: Abandoned Application

• Current Assignee: Gerald H.O. Kim
• Original Assignee: Gerald H.O. Kim
• Inventors: Kim, Gerald Ho
• Application Number:
  US14/948,368
• Publication Number:
  US 20160150678A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 23/147 Semiconductor insulating substrates semiconductor conductive substrates H01L23/4926
• CPC Class Codes: H01L 23/3738 Semiconductor materials
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20636 within sub-racks for removing heat from electronic boards

Abstract

Examples of a silicon cold plate with an integrated PCB are described. An apparatus may include a silicon plate, one or more electrical and thermal connections, and a heat-generating device. The silicon plate may include a first side and a second side opposite the first side, a plurality of edges between the first side and the second side, one or more internal coolant flow channels therein, one or more coolant inlet ports disposed on one or more of the edges and configured to allow a coolant to flow into the one or more internal coolant flow channels, and one or more coolant outlet ports disposed on one or more of the edges and configured to allow the coolant to flow out of the one or more internal coolant flow channels. The one or more electrical and thermal connections may be disposed on the first side of the silicon plate. The heat-generating device may be disposed on the one or more electrical and thermal connections.

Claims

1. An apparatus, comprising:

a silicon plate comprising;

a first side and a second side opposite the first side;

a plurality of edges between the first side and the second side;

one or more internal coolant flow channels therein;

one or more coolant inlet ports disposed on one or more of the edges and configured to allow a coolant to flow into the one or more internal coolant flow channels; and

one or more coolant outlet ports disposed on one or more of the edges and configured to allow the coolant to flow out of the one or more internal coolant flow channels;

one or more electrical and thermal connections disposed on the first side of the silicon plate; and

a heat-generating device disposed on the one or more electrical and thermal connections.

2. The apparatus of claim 1, wherein the heat-generating device comprises an integrated-circuit (IC) chip.

3. The apparatus of claim 1, wherein at least one of the one or more coolant inlet ports and the one or more coolant outlet ports comprises a hexagonal-shaped port.

4. The apparatus of claim 1, wherein the silicon plate comprises a first half plate and a second half plate, wherein each of the first half plate and the second half plate comprises a mating side, a carry side opposite the mating side, and a plurality of edges between the mating side and the carry side, and wherein the first half plate and the second half plate are bonded together with the mating side of the first half plate and the mating side of the second half plate facing each other.

5. The apparatus of claim 4, wherein at least one of the edges of the first half plate or the second half plate comprises a beveled edge.

6. The apparatus of claim 1, further comprising:

one or more pins electrically connected to the electrical and thermal connections, the one or more pins configured to accommodate an electrical connection between the heat-generating device and an external device.

7. The apparatus of claim 1, further comprising:

a substrate disposed on the first side of the silicon plate, the substrate comprising a through-hole configured to accommodate the heat-generating device when the substrate is disposed on the first side of the silicon plate.

8. The apparatus of claim 7, wherein the substrate comprises a printed circuit board (PCB).

9. The apparatus of claim 7, further comprising:

one or more integrated-circuit (IC) chips disposed on the substrate; and

an electrical connector disposed on the substrate, the electrical connector electrically connected to at least one of the heat-generating device and the one or more IC chips.

10. The apparatus of claim 9, further comprising:

a board;

a mating electrical connector disposed on the board, the mating electrical connector configured to electrically connect to the electrical connector;

fittings connected to the one or more coolant inlet ports and the one or more coolant outlet ports;

a pump configured to pump the coolant through the one or more coolant flow channels of the silicon plate;

a reservoir tank configured to store the coolant; and

tubes configured to connect the pump to the reservoir tank, connect the pump to the one or more coolant inlet ports, and connect the reservoir tank to the one or more coolant outlet ports.

15. The apparatus of claim 4, wherein at least one of the edges of the first half plate or the second half plate of the first silicon plate comprises a beveled edge.

11. An apparatus, comprising:

a first module comprising;

a first silicon plate comprising;

a first side and a second side opposite the first side;

a plurality of edges between the first side and the second side;

one or more internal coolant flow channels therein;

one or more coolant inlet ports disposed on one or more of the edges and configured to allow a coolant to flow into the one or more internal coolant flow channels; and

one or more coolant outlet ports disposed on one or more of the edges and configured to allow the coolant to flow out of the one or more internal coolant flow channels;

one or more first electrical and thermal connections disposed on the first side of the first silicon plate; and

a first heat-generating device disposed on the one or more first electrical and thermal connections; and

a second module comprising;

a second silicon plate comprising;

a first side and a second side opposite the first side;

a plurality of edges between the first side and the second side;

one or more internal coolant flow channels therein;

one or more coolant inlet ports disposed on one or more of the edges and configured to allow the coolant to flow into the one or more internal coolant flow channels; and

one or more coolant outlet ports disposed on one or more of the edges and configured to allow the coolant to flow out of the one or more internal coolant flow channels;

one or more second electrical and thermal connections disposed on the first side of the second silicon plate; and

a second heat-generating device disposed on the one or more second electrical and thermal connections.

12. The apparatus of claim 11, wherein each of the first heat-generating device and the second heat-generating device comprises an integrated-circuit (IC) chip.

13. The apparatus of claim 11, wherein at least one of the one or more coolant inlet ports and the one or more coolant outlet ports of each of the first silicon plate and the second silicon plate comprises a hexagonal-shaped port.

14. The apparatus of claim 11, wherein the first silicon plate comprises a first half plate and a second half plate, wherein each of the first half plate and the second half plate comprises a mating side, a carry side opposite the mating side, and a plurality of edges between the mating side and the carry side, and wherein the first half plate and the second half plate are bonded together with the mating side of the first half plate and the mating side of the second half plate facing each other.

16. The apparatus of claim 11, further comprising:

one or more pins electrically connected to the first electrical and thermal connections, the one or more pins configured to accommodate an electrical connection between the first heat-generating device and an external device.

17. The apparatus of claim 11, further comprising:

a first substrate disposed on the first side of the first silicon plate, the first substrate comprising a through-hole configured to accommodate the first heat-generating device when the first substrate is disposed on the first side of the first silicon plate; and

a second substrate disposed on the first side of the second silicon plate, the second substrate comprising a through-hole configured to accommodate the second heat-generating device when the second substrate is disposed on the first side of the second silicon plate.

18. The apparatus of claim 17, wherein each of the first substrate and the second substrate comprises a printed circuit board (PCB).

19. The apparatus of claim 17, further comprising:

one or more first integrated-circuit (IC) chips disposed on the first substrate;

one or more second IC chips disposed on the second substrate;

a first electrical connector disposed on the first substrate, the first electrical connector electrically connected to at least one of the first heat-generating device and the one or more first IC chips; and

a second electrical connector disposed on the second substrate, the second electrical connector electrically connected to at least one of the second heat second and the one or more second IC chips,

wherein the first module and the second module are stacked together with the first electrical connector and the second electrical connector mechanically and electrically connected together.

20. The apparatus of claim 19, further comprising:

a board;

a mating electrical connector disposed on the board, the mating electrical connector configured to electrically connect to the second electrical connector;

fittings connected to the one or more coolant inlet ports and the one or more coolant outlet ports of the second silicon plate of the second module;

a pump configured to pump the coolant through the one or more coolant flow channels of the first silicon plate of the first module and the one or more coolant flow channels of the second silicon plate of the second module;

a reservoir tank configured to store the coolant; and

tubes configured to connect the pump to the reservoir tank, connect the pump to the one or more coolant inlet ports, and connect the reservoir tank to the one or more coolant outlet ports.