MEMS CAPPING METHOD
1 Assignment
0 Petitions
Accused Products
Abstract
A method for fabricating a MEMS device includes providing a substrate having a front surface and a back surface, and forming a protruding engagement member on the front surface of the substrate. The protruding engagement member has an inner periphery defining a groove and an outer periphery. The method also includes forming a first trench having a first depth along the outer periphery, forming a patterned mask layer on the protruding engagement member covering the groove and exposing a portion of the first trench. The method further includes etching the exposed portion of the first trench to form a second trench having a second depth, removing the patterned mask layer, bonding the substrate with a MEMS substrate to form the MEMS device, and thinning the back surface to within the second depth. The method prevents dust from being deposited on the MEMS substrate as in the case of cutting.
16 Citations
20 Claims
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1-16. -16. (canceled)
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17. A MEMS device produced by a method comprising:
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providing a substrate with a front surface and a back surface; forming a protruding engagement member on the front surface of the substrate, the protruding engagement member having an inner periphery defining a groove; forming a first trench having a first depth along an outer periphery of the protruding engagement member; forming a patterned mask layer on the protruding engagement member covering the engagement member including the groove and exposing a portion of the first trench; etching the exposed portion of the first trench using the patterned mask layer as a mask to form a second trench having a second depth; removing the patterned mask layer; providing a MEMS substrate; and bonding the substrate with the MEMS substrate to form the MEMS device. - View Dependent Claims (18, 19, 20)
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Specification