SEMICONDUCTOR MODULE AND POWER CONVERTER

• US 20160155706A1
• Filed: 08/13/2015
• Published: 06/02/2016
• Est. Priority Date: 11/28/2014
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: YONEYAMA, Rei, GOTO, Akira
• Granted Patent: US 9,406,624 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/04026 Bonding areas specifically adapted for layer connectors
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/06181 On opposite sides of the body
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49052 Different loop heights
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10272 : Silicon Carbide [SiC]
• CPC Class Codes: H01L 2924/1033 : Gallium nitride [GaN]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A semiconductor module includes a case, a semiconductor component provided in the case for switching a current, encapsulating resin provided in the case for covering the semiconductor component, a magnetic shield contacting the encapsulating resin and containing a magnetic material, and an embedded magnetic shield embedded in the case, the embedded magnetic shield containing a magnetic material.

Claims

1. A semiconductor module comprising:

a case;

a semiconductor component provided in the case for switching a current;

encapsulating resin provided in the case for covering the semiconductor component;

a magnetic shield contacting the encapsulating resin and containing a magnetic material; and

an embedded magnetic shield embedded in the case, the embedded magnetic shield containing a magnetic material.

2. The semiconductor module according to claim 1, wherein the magnetic shield is formed on whole of an upper surface of the encapsulating resin.

3. The semiconductor module according to claim 1, wherein the embedded magnetic shield surrounds side surfaces of the semiconductor component.

4. The semiconductor module according to claim 1, wherein the embedded magnetic shield is provided on a lower surface side of the semiconductor component.

5. The semiconductor module according to claim 1, further comprising:

a control circuit board provided above the magnetic shield in the case; and

an electronic component fixed to the control circuit board.

8. The semiconductor module according to claim 1, wherein

a thermal conductivity of the magnetic shield is higher than a thermal conductivity of the encapsulating resin, and

surface roughness of an upper surface of the magnetic shield is larger than surface roughness of an upper surface of the encapsulating resin.

9. The semiconductor module according to claim 1, wherein the magnetic shield is resin containing a magnetic material.

10. The semiconductor module according to claim 9, wherein the magnetic shield is epoxy resin containing ferrite powder.

11. The semiconductor module according to claim 1, wherein the magnetic shield is any one of liquid, gel, rubber, and elastomer.

12. The semiconductor module according to claim 1, wherein the semiconductor component is made of a wide-bandgap semiconductor.

13. The semiconductor module according to claim 12, wherein the wide-bandgap semiconductor is any one of silicon carbide, gallium nitride materials, and diamond.

6. A semiconductor module comprising:

a case;

a semiconductor component provided in the case for switching a current;

encapsulating resin provided in the case for covering the semiconductor component;

a magnetic shield contacting the encapsulating resin and containing a magnetic material;

a control circuit board provided above the magnetic shield in the case; and

an electronic component fixed to the control circuit board.

7. The semiconductor module according to claims 6, wherein the electronic component comprises a micro transformer for performing communications by giving and receiving magnetic fields.

14. A power converter comprising:

a semiconductor module comprising;

a case;

a semiconductor component provided in the case for switching a current;

encapsulating resin provided in the case for covering the semiconductor component;

a magnetic shield contacting the encapsulating resin and containing a magnetic material; and

an embedded magnetic shield embedded in the case, the embedded magnetic shield containing a magnetic material; and

a control circuit provided outside the semiconductor module for transmitting a control signal to the semiconductor component.