METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE STRUCTURE
First Claim
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1. A method of manufacturing a light-emitting package structure, comprising:
- disposing on a carrier at least one light emitting element that has opposite first and second sides and a plurality of third sides connected to the first side and the second side, wherein the light emitting element is disposed on the carrier via the second side; and
forming on the third side of the light emitting element a reflective material that acts as a reflective film.
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Abstract
A method of manufacturing a light-emitting package structure is provided. The method includes disposing at least one light emitting element on a carrier and forming a reflective material. The light emitting element has opposite first and second sides and a plurality of third sides connected to the first side and the second side. The light emitting element is disposed on the carrier via the second side. The reflective material is formed on the third side of the light emitting element, so as to form a reflective film.
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18 Claims
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1. A method of manufacturing a light-emitting package structure, comprising:
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disposing on a carrier at least one light emitting element that has opposite first and second sides and a plurality of third sides connected to the first side and the second side, wherein the light emitting element is disposed on the carrier via the second side; and forming on the third side of the light emitting element a reflective material that acts as a reflective film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification