BUNG-TYPE ANTENNA AND ANTENNAL STRUCTURE AND ANTENNAL ASSEMBLY ASSOCIATED THEREWITH
First Claim
1. An antenna structure suitable for being placed on a ground plane, comprising:
- a three-dimensional carrier substrate made of a partially apertured dielectric material comprising a peripheral wall that extends between a proximal end and a distal end, said carrier substrate defining an internal volume;
a first conductive pattern inscribed on the peripheral wall of the carrier substrate, the first conductive pattern having a lower end suitable for being connected to a ground plane and an upper end; and
a second conductive pattern contained in the volume of the substrate, the second pattern being electrically connected to the upper end of the first pattern.
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Accused Products
Abstract
The invention relates to an antennal structure adapted to be disposed on an earth plane comprising: a three-dimensional support substrate made of a dielectric material which is partially hollowed out and comprising a peripheral wall which extends between a proximal end and a distal end, said support substrate defining an internal volume; a first conducting pattern inscribed on the peripheral wall of the support substrate, the first conducting pattern comprising a lower end adapted to be connected to an earth plane and an upper end; a second conducting pattern contained in the volume of the substrate, the second pattern being connected electrically to the upper end of the first pattern.
28 Citations
15 Claims
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1. An antenna structure suitable for being placed on a ground plane, comprising:
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a three-dimensional carrier substrate made of a partially apertured dielectric material comprising a peripheral wall that extends between a proximal end and a distal end, said carrier substrate defining an internal volume; a first conductive pattern inscribed on the peripheral wall of the carrier substrate, the first conductive pattern having a lower end suitable for being connected to a ground plane and an upper end; and a second conductive pattern contained in the volume of the substrate, the second pattern being electrically connected to the upper end of the first pattern. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification