PRINTED CIRCUIT BOARD HAVING ELECTRONIC COMPONENT EMBEDDED

• US 20160157352A1
• Filed: 02/02/2016
• Published: 06/02/2016
• Est. Priority Date: 11/05/2013
• Status: Active Grant

• Current Assignee: SunASIC Technologies
• Original Assignee: SunASIC Technologies
• Inventors: Lin, Chi-Chou
• Granted Patent: US 9,907,178 B2
• Time in Patent Office: Days
• CPC Class Codes: B42D 25/313 Fingerprints
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/0187 with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/0919 Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
• CPC Class Codes: H05K 2201/09845 Stepped hole, via, edge, bump or conductor
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2201/10287 Metal wires as connectors or conductors
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 3/0044 Mechanical working of the substrate, e.g. drilling or punching H05K3/0008 takes precedence
• CPC Class Codes: H05K 3/4046 : using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: H05K 3/421 : Blind plated via connections H05K3/422, H05K3/423 and H05K3/425 take precedence
• CPC Class Codes: H05K 3/4623 : the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence
• CPC Class Codes: H05K 3/4697 : having cavities, e.g. for mounting components H05K3/4691 takes precedence
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A printed circuit board having an electronic component embedded is disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.

Claims

1. A printed circuit board having an electronic component embedded, comprising:

a first electrically conductive layer;

a first core layer having a portion removed to expose at least a portion of the electronic component and a portion of a second core layer;

the second electrically conductive layer;

a second core layer having an area which is hollow so as to locate the electronic component therein;

a third electrically conductive layer;

a third core layer; and

a fourth electrically conductive layer,

wherein a bound pad is formed on a portion of a top surface of the electronic component, a plurality of via holes from the bound pad to the first electrically conductive layer are formed and electrically connected therebetween, each of the electrically conductive layers forms a desired circuit, and at least one side of an exposed top surface of the electronic component is higher than or equal to a side of a top surface of the exposed second core layer neighboring to each other.

2. The printed circuit board according to claim 1, wherein the electronic component is an integrated circuit (IC), a module or a light emitting diode (LED).

3. The printed circuit board according to claim 2, wherein the integrated circuit is a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS).

4. The printed circuit board according to claim 2, wherein the module is a fingerprint reader module.

5. The printed circuit board according to claim 1, wherein the bound pad is a layer of copper, aluminum, gold or alloy thereof, having thickness of 4 μ

m or thicker.

6. The printed circuit board according to claim 1, wherein the bound pad is at least 200 μ

m×

200 μ

m.

7. The printed circuit board according to claim 1, wherein the via hole is a laser via hold or a plated through hole.

8. The printed circuit board according to claim 7, wherein a wire bonding is applied in the laser via hole to electrically connect two sides thereof.

9. The printed circuit board according to claim 1, wherein an adhesive is applied between adjacent electrically conductive layer and core layer for lamination.

10. The printed circuit board according to claim 1, wherein the bound pad is used to electrically link the electronic component to the first electrically conductive layer and provide protection to the electronic component when the via holes are forming.