ENVIRONMENT-RESISTANT MODULE, MICROPACKAGE AND METHODS OF MANUFACTURING SAME

• US 20160159641A1
• Filed: 04/14/2014
• Published: 06/09/2016
• Est. Priority Date: 06/07/2007
• Status: Active Grant

• Current Assignee: Bliley Technologies, Inc. (Kyocera Corporation), Board of Regents of the University of Michigan (University of Michigan)
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Najafi, Khalil, Lee, Sang-hyun, Lee, Sang Woo, MITCHELL, Jay Stewart, Srivannavit, Onnop
• Granted Patent: US 10,266,392 B2
• Time in Patent Office: Days
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/0278 Temperature sensors
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: B81C 2203/031 Anodic bondings
• CPC Class Codes: B81C 2203/035 Soldering
• CPC Class Codes: B81C 3/005 Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.

Claims

1. An environment-resistant module including a packaged device, the module comprising:

a package;

a device located within the package;

a microplatform located within the package, the device being supported on the platform;

a support structure to support the microplatform and the device within the package; and

an outer region of material about the support structure and supporting the support structure;

wherein the microplatform, the support structure, and the outer region of material are substantially planar in a lateral direction and are all at least partially defined by a single planar layer of insulative material.

2. The module of claim 1, wherein the device is at least one of a quartz device, a gyroscope, an accelerometer, a magnetometer, a second microplatform, a biomedical device, and a microfluidic device.

3. The module of claim 1, further comprising a second package that at least partially houses the device, wherein the second package is located within the package and is supported by the platform;

4. The module of claim 1, wherein the device includes at least one of an oven circuit and a device circuit.

5. The module of claim 1, wherein the device is mounted on and electrically connected to the microplatform via a conductive material.

6. The module of claim 1, wherein the microplatform is mounted and electrically connected to the package via a conductive material.

7. The module of claim 1, further comprising at least one bonding pad between the device and the microplatform.

8. The module of claim 1, wherein the package is at least one of a metal package, a ceramic package, a plastic package, a silicon package, and a glass package.

9. The module of claim 1, wherein the device is electrically connected to at least a portion of the microplatform, and wherein the package includes a feedthrough that includes conductive material that electrically connects the microplatform to an environment outside the package.

10. The module of claim 1, further comprising a temperature sensor contacting or adjacent to the package for detecting the temperature of the package.

11. The module of claim 1, wherein the microplatform supports a first side of the device, the module further comprising a second microplatform located within the package that supports a second side of the device opposite the first side.

12. An environment-resistant module including a device, the module comprising:

a microplatform;

a device supported by the microplatform;

a support structure supporting the microplatform and the device; and

an outer region of material about the support structure and supporting the support structure;

wherein the microplatform, the support structure, and the outer region of material are substantially planar in a lateral direction and are all at least partially defined by a single planar layer of insulative material.

13. The module of claim 12, further comprises a package that defines a cavity, wherein the microplatform, the device and at least a portion of the support structure are located within the cavity.

14. The module of claim 12, wherein the device is at least one of a quartz device, gyroscope, accelerometer, magnetometer, biomedical device, microfluidic device, oven circuit, and device circuit.

15. A method of making a packaged device, the method comprising:

providing a package;

providing a device within the package; and

out of a single substantially planar layer of insulative material, batch fabricating (i) a microplatform located within the package to support the device;

(ii) a support structure to support the microplatform, and (iii) an outer region of material about the support structure and supporting the support structure.

16. The method of claim 15, further comprising mounting the device on the microplatform via at least one of soldering, reflow flip chip bonding, bump bonding, anodic bonding, and eutectic bonding.

17. The method of claim 15, further comprising bonding the device to the microplatform via a bonding pad, and electrically connecting the device to the bonding pad via at least one of soldering, reflow flip chip bonding, bump bonding, eutectic bonding, and wirebonding.

18. The method of claim 15, further comprising mounting at least one of the microplatform, the support structure and the outer region to the package via at least one of soldering, reflow flip chip bonding, bump bonding, and anodic bonding, eutectic bonding.

19. The method of claim 15, wherein the microplatform and the package are integrally formed from the same material.

20. The method of claim 15, further comprising electrically connecting the microplatform to an environment outside of the package via at least one feedthrough, and electrically connecting the microplatform to the at least one feedthrough via at least one of soldering, reflow flip chip bonding, bump bonding, eutectic bonding, and wirebonding.