ENVIRONMENT-RESISTANT MODULE, MICROPACKAGE AND METHODS OF MANUFACTURING SAME
First Claim
1. An environment-resistant module including a packaged device, the module comprising:
- a package;
a device located within the package;
a microplatform located within the package, the device being supported on the platform;
a support structure to support the microplatform and the device within the package; and
an outer region of material about the support structure and supporting the support structure;
wherein the microplatform, the support structure, and the outer region of material are substantially planar in a lateral direction and are all at least partially defined by a single planar layer of insulative material.
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Accused Products
Abstract
An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.
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Citations
20 Claims
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1. An environment-resistant module including a packaged device, the module comprising:
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a package; a device located within the package; a microplatform located within the package, the device being supported on the platform; a support structure to support the microplatform and the device within the package; and an outer region of material about the support structure and supporting the support structure; wherein the microplatform, the support structure, and the outer region of material are substantially planar in a lateral direction and are all at least partially defined by a single planar layer of insulative material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An environment-resistant module including a device, the module comprising:
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a microplatform; a device supported by the microplatform; a support structure supporting the microplatform and the device; and an outer region of material about the support structure and supporting the support structure; wherein the microplatform, the support structure, and the outer region of material are substantially planar in a lateral direction and are all at least partially defined by a single planar layer of insulative material. - View Dependent Claims (13, 14)
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15. A method of making a packaged device, the method comprising:
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providing a package; providing a device within the package; and out of a single substantially planar layer of insulative material, batch fabricating (i) a microplatform located within the package to support the device;
(ii) a support structure to support the microplatform, and (iii) an outer region of material about the support structure and supporting the support structure. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification