MEMS Integrated Pressure Sensor Devices and Methods of Forming Same
First Claim
1. A method comprising:
- providing a device substrate comprising a membrane for a first micro-electromechanical (MEMS) device;
bonding a carrier having a first cavity to the device substrate, wherein bonding the carrier includes aligning the first cavity with a first surface of the membrane;
patterning the device substrate to define a first MEMS structure aligned with the membrane;
bonding a cap to the device substrate to form a second cavity comprising a second surface of the membrane and the first MEMS structure; and
patterning the carrier to expose the first cavity to ambient pressure.
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Abstract
A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.
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Citations
20 Claims
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1. A method comprising:
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providing a device substrate comprising a membrane for a first micro-electromechanical (MEMS) device; bonding a carrier having a first cavity to the device substrate, wherein bonding the carrier includes aligning the first cavity with a first surface of the membrane; patterning the device substrate to define a first MEMS structure aligned with the membrane; bonding a cap to the device substrate to form a second cavity comprising a second surface of the membrane and the first MEMS structure; and patterning the carrier to expose the first cavity to ambient pressure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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providing a device substrate comprising a membrane for a pressure sensor device; bonding a carrier to the device substrate to define a first cavity, wherein a first surface of the membrane is exposed to a pressure level of the first cavity; patterning the device substrate to define; a first micro-electromechanical (MEMS) structure aligned with the membrane; and a second MEMS structure adjacent the first MEMS structure; and bonding a cap to an opposing side of the device substrate as the carrier, wherein bonding the cap defines; a second cavity comprising the first MEMS structure, wherein a second surface of the membrane is exposed to an ambient pressure level through the second cavity; and a third cavity comprising the second MEMS structure. - View Dependent Claims (10, 11, 12, 13)
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14. A micro-electromechanical (MEMS) device comprising:
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a device substrate comprising; a membrane for a pressure sensor, wherein a first surface of the membrane is exposed to a sealed pressure level of a first cavity and a second surface of the membrane is exposed to an ambient pressure level; and a first MEMS structure over and aligned with the membrane; a cap over first MEMS structure and bonded to the device substrate by a plurality of eutectic bonds; and a carrier bonded to an opposing side of the device substrate as the cap. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification