×

MEMS Integrated Pressure Sensor Devices and Methods of Forming Same

  • US 20160159644A1
  • Filed: 02/15/2016
  • Published: 06/09/2016
  • Est. Priority Date: 03/14/2013
  • Status: Active Grant
First Claim
Patent Images

1. A method comprising:

  • providing a device substrate comprising a membrane for a first micro-electromechanical (MEMS) device;

    bonding a carrier having a first cavity to the device substrate, wherein bonding the carrier includes aligning the first cavity with a first surface of the membrane;

    patterning the device substrate to define a first MEMS structure aligned with the membrane;

    bonding a cap to the device substrate to form a second cavity comprising a second surface of the membrane and the first MEMS structure; and

    patterning the carrier to expose the first cavity to ambient pressure.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×