WIRELESS PROBES
First Claim
1. A probe card for testing a wireless module on an integrated circuit die contained on a wafer, the probe card comprising:
- a housing;
a connector disposed on the housing, the connector for connecting the probe card to test equipment;
a plurality of probes to probe a wafer containing a plurality of integrated circuit dies, the plurality of probes protruding from the housing; and
an antenna configured to transmit a wireless test signal to be received by at least one of the integrated circuit dies, and/or to receive a wireless signal transmitted by at least one of the integrated circuit dies.
5 Assignments
0 Petitions
Accused Products
Abstract
Disclosed is a probe card for testing a wireless module on an integrated circuit die contained on a wafer. The probe card includes a connector and a plurality of probes. The connector connects the probe card to test equipment. The plurality of probes connects the probe card to a wafer containing a plurality of integrated circuit dies. The probe card additionally includes an antenna configured to transmit a wireless test signal to be received by at least one of the integrated circuit dies, and/or to receive a wireless signal transmitted by at least one of the integrated circuit dies.
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Citations
20 Claims
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1. A probe card for testing a wireless module on an integrated circuit die contained on a wafer, the probe card comprising:
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a housing; a connector disposed on the housing, the connector for connecting the probe card to test equipment; a plurality of probes to probe a wafer containing a plurality of integrated circuit dies, the plurality of probes protruding from the housing; and an antenna configured to transmit a wireless test signal to be received by at least one of the integrated circuit dies, and/or to receive a wireless signal transmitted by at least one of the integrated circuit dies. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for testing an integrated circuit die comprising:
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probing the integrated circuit die using a probe card, the probe card including a probe card antenna; sending a signal to the integrated circuit die to receive a wireless signal; transmitting a wireless signal using the antenna of the wireless probe card; receiving an output signal from the integrated circuit die; and determining whether the integrated circuit die contains defects based on the received output signal. - View Dependent Claims (13, 14, 15, 16)
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17. A probe card for testing a wireless module on an integrated circuit die contained on a wafer, the probe card comprising:
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a connector for connecting the probe card to test equipment; a plurality of probes to probe a wafer containing a plurality of integrated circuit dies; and an antenna configured to transmit a wireless test signal to be received by at least one of the integrated circuit dies, and/or to receive a wireless signal transmitted by at least one of the integrated circuit dies. - View Dependent Claims (18, 19, 20)
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Specification