FINGERPRINT IDENTIFICATION DEVICE AND METHOD FOR MANUFACTURING THEREOF

• US 20160162724A1
• Filed: 03/24/2015
• Published: 06/09/2016
• Est. Priority Date: 12/03/2014
• Status: Abandoned Application

• Current Assignee: Key Application Technology Co., Ltd.
• Original Assignee: Key Application Technology Co., Ltd.
• Inventors: HSIAO, Chien-Jen, TSENG, Shih-Hsiu
• Application Number:
  US14/666,308
• Publication Number:
  US 20160162724A1
• Time in Patent Office: Days
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger

Abstract

The present disclosure provides a fingerprint identification device including a substrate, a sensitive die, a packaging material layer and a protection film. The sensitive die is positioned on the substrate, and has a top surface. The packaging material layer is positioned on the substrate, surrounding the sensitive die and exposing the top surface of the sensitive die, wherein a top surface of the packaging material layer and the top surface of the sensitive die have a coplanar. The protection film covers the sensitive die and the packaging material layer, wherein a material of the protection film is different from that of the packaging material layer. A method for manufacturing a fingerprint identification device is also provided herein.

Claims

1. A fingerprint identification device, comprising:

a substrate;

a sensor chip disposed on the substrate and having a top surface;

a glue layer disposed on the substrate, surrounding the sensor chip and exposing the top surface of the sensor chip, wherein a top surface of the glue layer is coplanar with the top surface of the sensor chip; and

a protection film covering the sensor chip and the glue layer, wherein a material of the protection film is different from a material of the glue layer.

2. The fingerprint identification device of claim 1, wherein the substrate comprises a circuit board or an insulating substrate.

3. The fingerprint identification device of claim 2, wherein the sensor chip is electrically connected to the circuit board.

4. The fingerprint identification device of claim 1, further comprising a first adhesion layer sandwiched between the sensor chip and the substrate.

5. The fingerprint identification device of claim 1, wherein the sensor chip comprises a fingerprint identified chip.

6. The fingerprint identification device of claim 1, wherein a material of the glue layer comprises an insulating composite.

7. The fingerprint identification device of claim 6, wherein the insulating composite comprises an epoxy resin.

8. , The fingerprint identification device of claim 1, wherein the protection film comprises:

a color-coating layer covering the sensor chip and the glue layer; and

an optical anti-wear layer covering the color-coating layer.

9. The fingerprint identification device of claim 7, wherein the optical anti-wear layer comprises an optical hard coat layer or an optical glass layer.

10. The fingerprint identification device of claim 7, wherein the protection film comprises a second adhesive layer sandwiched between the color-coating layer and the sensor chip and between the color-coating layer and the glue layer.

11. The fingerprint identification device of claim 1, wherein a thickness of the protection film is in a range of 20-50 μ

m.

12. A method for manufacturing a fingerprint identification device, comprising:

forming a sensor chip on a substrate;

forming a glue layer on the substrate, the glue layer surrounding the sensor chip and exposing a top surface of the sensor chip, wherein a top surface of the glue layer and the top surface of the sensor board are formed a flat surface; and

forming a protection film on the sensor chip and the glue layer.

13. The method of claim 12, further comprising forming a first adhesion layer between the sensor chip and the substrate.

14. The method of claim 12, wherein forming the protection film comprises:

forming a color-coating layer on the sensor chip and the glue layer; and

forming an optical anti-wear layer covering the color-coating layer.

15. The method of claim 14, wherein forming the optical anti-wear layer comprises forming an optical hard coat layer or forming an optical glass layer.

16. The method of claim 14, wherein forming the protection film further comprises forming a second adhesion layer between the color-coating layer and the sensor chip and between the color-coating layer and the glue layer.