CARDIAC OR CEREBRAL VESSEL MICROLEAD WITH ELECTRODE RING

• US 20160166827A1
• Filed: 02/19/2016
• Published: 06/16/2016
• Est. Priority Date: 05/16/2012
• Status: Active Grant

• Current Assignee: Sorin CRM USA (MicroPort Scientific Corp.)
• Original Assignee: Sorin CRM USA (MicroPort Scientific Corp.)
• Inventors: Ollivier, Jean-Franois, Shan, Nicolas, D'Hiver, Philippe
• Granted Patent: US 10,071,238 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0534 Electrodes for deep brain stimulation
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: A61N 1/372 Arrangements in connection with the implantation of stimulators
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A method of manufacturing a detection/stimulation lead for implantation into a venous, arterial, or lymphatic network is shown and described. The method includes providing a microcable comprising a sheath of insulating material covering an electrically conductive core. The method further includes surrounding a portion of the microcable with an electrically conductive metal ring. The method also includes crimping the ring such that the thickness of the sheath is penetrated by a portion of the metal ring and such that an electrical connection is formed between the metal ring and the electrically conductive core.

Claims

1. A lead for implantation in a venous, arterial or lymphatic network, comprising:

a conductor adapted to be connected to a generator of an active implantable medical device;

a sheath of electrically insulating polymer material covering the conductor on its periphery and along its length; and

an electrode formed by a ring electrically connected to the conductor via a puncture through the sheath and in contact with the conductor.

2. The lead of claim 1, wherein the external diameter of the lead is equal to or less than 2 French (0.66 mm) and the lead does not include an internal lumen for a guidewire.

3. The lead of claim 1, wherein the ring comprises two end portions extending in a longitudinal direction, wherein the two end portions are on either side of a central portion, wherein the end portions do not directly contact the conductor and are in direct contact with the sheath.

4. The lead of claim 1, wherein the ring is crimped on the microcable in a location not previously stripped of the sheath.

5. The lead of claim 1, wherein the wall thickness of the ring is between 20 and 100 μ

m, wherein the length of the ring is between 0.5 and 1.5 mm, wherein the wall thickness of the sheath is between 5 and 50 μ

m, and wherein the material of the ring comprises an alloy of platinum-iridium or palladium.

6. The lead of claim 1, wherein the ring has a differential crimping profile and penetrates the sheath at a central portion of the ring.

7. The lead of claim 1, wherein the ring comprises a variable longitudinal profile on the inner surface of the ring defining a smaller diameter in a central portion than at an end portion on either side of the central portion.

8. The lead of claim 1, wherein the ring comprises a relief on the inner surface of the ring, the relief creating a portion of the inner surface having a reduced diameter.

9. A metal ring for installation as an electrode on a microcable, comprising:

an elongated ring having an internal lumen;

a middle portion partially collapsed into the internal lumen adapted to puncture a sheath of the microcable when the middle portion is crimped around the microcable; and

two end portions surrounding the middle portion.

10. The metal ring of claim 9, wherein an interior surface of the middle portion of the ring comprises a plurality of helically oriented ribs.

11. The metal ring of claim 9, wherein the two end portions extend in a longitudinal direction perpendicular to the elongated axis of the lead, wherein the two end portions are on either side of the middle portion, wherein the end portions do not directly contact the conductor and are in direct contact with the sheath.

12. The metal ring of claim 9, wherein the ring includes an interior relief defining an area at which the ring is adapted to puncture the sheath.

13. The metal ring of claim 12, wherein the relief comprises a longitudinal profile positioned to share an elongated axis with the microcable.

14. The metal ring of claim 12, wherein the relief comprises a thickened portion formed on an interior or exterior surface of the ring.

15. The metal ring of claim 12, wherein the relief does not extend up to an edge of the ring.

16. The metal ring of claim 12, wherein the relief comprises a circumferential profile perpendicular to an elongated axis with the microcable.

17. The metal ring of claim 16, wherein the relief does not extend around an entire interior circumference of the metal ring.

18. The metal ring of claim 9, wherein a wall thickness of the ring is between 20 and 100 μ

m.

19. The metal ring of claim 9, wherein the length of the ring is between 0.5 and 1.5 mm.

20. The metal ring of claim 9, wherein the material of the ring comprises an alloy of platinum-iridium or palladium.