METHOD AND APPARATUS FOR LOCATING A PREFORM ON A MOLD

• US 20160167894A1
• Filed: 12/11/2015
• Published: 06/16/2016
• Est. Priority Date: 12/15/2014
• Status: Active Grant

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Nassau, Andrew Nathan, Morris, Kevin Thomas, Shultz, Michael George, Towner, Matthew John, Uhlig, Kevin William, Ukrainczyk, Ljerka, Yorio, Thomas Achille
• Granted Patent: US 10,640,304 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B29C 31/008 Handling preformed parts, e.g. inserts B29C37/001 takes precedence; for injection moulding B29C45/14008; for blow moulding B29C49/2408; for thermoforming B29C51/165
• CPC Class Codes: B65G 47/905 Control arrangements
• CPC Class Codes: C03B 2215/61 Positioning the glass to be pressed with respect to the press dies or press axis
• CPC Class Codes: C03B 2225/02 Means for positioning, aligning or orientating the sheets during their travel, e.g. stops
• CPC Class Codes: C03B 23/023 by bending
• CPC Class Codes: C03B 23/0357 by suction without blowing, e.g. with vacuum or by venturi effect
• CPC Class Codes: C03B 35/202 by supporting frames C03B35/145 takes precedence

Abstract

An apparatus for locating a preform on a mold includes a preform handling tool and a force sensor coupled to the preform handling tool such that the force sensor is capable of sensing forces applied to the preform during handling of the preform by the preform handling tool. The apparatus includes a control device that is arranged and operable to move the preform handling tool relative to the mold. A method of locating the preform on the mold includes picking up the preform using the preform handling tool and placing the preform in a vicinity of the mold. Positions on the mold are mapped with an edge of the preform with the aid of the force sensor. The preform is paced on the mold according to the mapped positions.

Claims

1. An apparatus for locating a preform on a mold, comprising:

a preform handling tool;

a force sensor coupled to the preform handling tool wherein the force sensor is capable of sensing forces applied to the preform during handling of the preform by the preform handling tool; and

a control device arranged and operable to move the preform handling tool relative to the mold.

2. The apparatus of claim 1, further comprising a cooling arrangement for creating a thermally-controlled bubble around the force sensor.

3. The apparatus of claim 2, wherein the cooling arrangement is configured to maintain temperatures within the thermally-controlled bubble to below a rated maximum operating temperature of the force sensor.

4. The apparatus of claim 2, wherein the cooling arrangement comprises a cooling can arranged to at least partially circumscribe the force sensor.

5. The apparatus of claim 4, wherein the cooling can has a double wall, and wherein a cooling can chamber for circulation of cooling fluid is located within the double wall.

6. The apparatus of claim 5, wherein the control device comprises a robot arm, wherein the robot arm is coupled to the force sensor, and wherein the cooling can comprises a clearance for the robot arm.

7. The apparatus of claim 2, wherein the cooling arrangement comprises a cooling plate arranged proximate or in contact with the force sensor.

8. The apparatus of claim 7, wherein the cooling plate has a double wall, and wherein a cooling plate chamber for circulation of cooling fluid is located within the double wall.

9. The apparatus of claim 2, wherein the cooling arrangement comprises a heat shield mounted proximate the cooling can to block external heat radiation directed towards the force sensor.

10. The apparatus of claim 2, wherein the cooling arrangement comprises at least one vortex tube arranged proximate the force sensor for spot cooling of the force sensor.

11. The apparatus of claim 1, wherein the control device comprises a robot arm, and wherein the force sensor is coupled to the robot arm.

12. A method of locating a preform on a mold, comprising:

providing a preform handling tool coupled to a force sensor;

picking the preform up with the preform handling tool and placing the preform in a vicinity of the mold;

mapping positions on the mold with an edge of the preform with the aid of the force sensor; and

placing the preform on the mold according to the mapped positions.

13. The method of claim 12, further comprising maintaining the force sensor at safe temperatures by providing a thermally-controlled bubble around the force sensor during the mapping positions and maintain temperatures within the thermally-controlled bubble to below a rated maximum operating temperature of the force sensor.

14. The method of claim 13, wherein the mapping positions comprises moving the preform relative to the mold and monitoring an output of the force sensor for an indication of a contact between the preform and a set of locating pins on the mold.

15. The method of claim 14, wherein the mapping positions comprises moving the preform along a first axis until the force sensor registers contact between an edge of the preform and a first locating pin on a second axis transverse to the first axis.

16. The method of claim 15, wherein the mapping positions further comprises moving the preform along the second axis until the force sensor registers contact between the edge of the preform and a second locating pin on the first axis.

17. The method of claim 16, wherein the mapping positions further comprises rotating the preform until the force sensor registers contact between the edge of the preform and both the second locating pin and a third locating on the first axis.

18. The method of claim 13, wherein providing the thermally-controlled bubble around the force sensor comprises selectively cooling the force sensor.

19. The method of claim 13, wherein providing the thermally-controlled bubble around the force sensor comprises providing a heat shield to block external heat radiation directed towards the force sensor.

20. The method of claim 13, wherein maintaining the force sensor at safe temperatures comprises maintaining temperatures within the thermally-controlled bubble below 60°

C. through one or both of cooling the force sensor and shielding the force sensor from external heat radiation.