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INTEGRATED PHOTONICS MODE EXPANDER

  • US 20160170142A1
  • Filed: 02/23/2016
  • Published: 06/16/2016
  • Est. Priority Date: 08/30/2011
  • Status: Active Grant
First Claim
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1. A method of fabricating a waveguide mode expander, the method comprising:

  • providing a silicon on insulator (SOI) substrate comprising a waveguide, wherein;

    the waveguide defines a waveguide thickness and terminates at an output end, andthe waveguide supports an optical mode of an initial mode size at the output end;

    forming a mounting region adjacent the output end of the waveguide;

    providing a multi-layer chiplet comprising one or more optical materials, whereina first layer of the one or more optical materials defines a first layer thickness that supports an input optical mode size substantially the same size as the initial mode size, andone or more overlying layers define thicknesses that, when combined with the first layer, support an output optical mode size that is larger than the initial mode size;

    bonding the chiplet in the mounting region; and

    selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end of the chiplet adjacent the waveguide, to a distal end of the chiplet, each tapered stage being formed of a portion of a respective layer of the multi-layer chiplet,such that the first layer and the tapered stages form a waveguide mode expander that adiabatically expands an optical mode of light traversing the chiplet, from the initial optical mode size entering the proximal end, to the output optical mode size at the distal end.

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