METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN HIGH VOLUME MANUFACTURING

• US 20160172222A1
• Filed: 02/22/2016
• Published: 06/16/2016
• Est. Priority Date: 12/28/2013
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: JOHNSON, John C., SANE, Sandeep B., RAZDAN, Sandeep, PRACK, Edward R., ARANA, Leonel R., DAVISON, Peter A., MORET, Eric J., PALANUK, Lawrence M., STONE, Gregory A.
• Granted Patent: US 9,496,161 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/67265 of substrates stored in a container, a magazine, a carrier, a boat or the like
• CPC Class Codes: H01L 21/67309 characterized by the substrate support
• CPC Class Codes: H01L 21/67333 Trays for chips magazine for components H05K13/0084
• CPC Class Codes: H01L 21/67356 specially adapted for containing chips, dies or ICs
• CPC Class Codes: H01L 21/67363 specially adapted for containing substrates other than wafers H01L21/67356, H01L21/67359 take precedence
• CPC Class Codes: H01L 21/67383 characterised by substrate supports
• CPC Class Codes: H01L 21/67769 Storage means
• CPC Class Codes: H01L 21/67772 involving removal of lid, door, cover
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 21/68764 characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
• CPC Class Codes: H01L 21/68771 characterised by supporting more than one semiconductor substrate
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H05K 13/0084 Containers and magazines for components, e.g. tube-like magazines

Abstract

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Claims

1. A method of processing a plurality of die, comprising:

identifying a wafer position for a plurality of die on a wafer;

storing the wafer position for each of the plurality of die in a database;

dicing the wafer into a plurality of singulated die;

positioning each of the singulated die in a die position location on a tray;

storing the die position on the tray for each of the singulated die in the database, wherein the database includes information including the wafer position associated with each die position;

transporting the tray to a processing tool;

removing at least one of the plurality of singulated die from the die position on the tray and processing the singulated die in the processing tool; and

replacing the processed singulated die in the same defined location on the tray that the singulated die was positioned in prior to the processing.

2. The method of claim 1, further comprising positioning the tray in a carrier after the positioning each of the singulated die on the tray.

3. The method of claim 2, further comprising providing a plurality of additional trays each including a plurality of singulated die from the wafer, wherein the tray and the additional trays each have a unique identifier thereon.

4. The method of claim 3, wherein the wafer is configured to include a plurality of regions on which the die are positioned, and wherein at least some of the trays are populated with singulated die from each of the regions.

5. The method of claim 4, wherein the trays with singulated die from each of the regions are transported to a different processing tool.

6. The method of claim 3, wherein the additional trays are positioned in a plurality of additional carriers.

7. The method of claim 6, wherein the carrier and the additional carriers each have a unique identifier positioned thereon.

8. The method of claim 1, wherein the processing tool includes a recipe that accesses the database to determine processing parameters for the singulated die on the tray.

9. The method of claim 8, wherein different singulated die on the tray have different processing parameters.

10. The method of claim 1, wherein the singulated die include no accessible unique identifying information thereon.

11. An assembly configured to hold a plurality of singulated die, comprising:

a movable tray configured to support a plurality of singulated die, the tray including a raised step at an outer region thereof; and

a lid adapted to cover the singulated die on the tray, wherein an outer edge of the lid engages an inner edge of the step.

12. The assembly of claim 11, wherein the tray includes a plurality of pockets defined on an upper surface thereof, wherein the pockets are each sized accept a single die therein.

13. The assembly of claim 12, wherein the lid includes a plurality of pedestal structures protruding in a downward direction on a lower surface of the lid, wherein the pedestal structures are sized to extend a distance into the pockets when the lid is positioned on the tray.

14. A carrier configured to hold a plurality of trays, the trays configured to hold a plurality of singulated die, the carrier comprising:

a plurality of rails configured to hold the trays thereon;

wherein the trays are individually accessible in any order from the carrier; and

a protrusion extending upward on an upper surface of the carrier, the protrusion configured to be coupled to an automated carrier handling system.

15. The carrier of claim 14, further comprising a patterned lower surface configured to engage a load port on a tool.

16. The carrier of claim 14, wherein the protrusion has a substantially T-shaped cross-section.

17. The carrier of claim 14, wherein the rails are configured so that the carrier can accept two columns of multiple trays therein.

18. A tray configured to support a plurality of singulated die thereon, comprising:

a core layer comprising a polymer;

a plurality of electrodes positioned on the core layer;

a dielectric layer positioned on the electrodes and extending therebetween, wherein the dielectric layer comprises a polymer; and

a surface on which a plurality of singulated die may be positioned;

wherein the electrodes are configured so that upon application of a voltage potential to induce an electric charge, adjacent electrodes have an opposite charge.

19. The tray of claim 18, further comprising a power source positioned on the tray.

20. The tray of claim 18, further comprising a lid configured to be positioned on the tray.

21. The tray of claim 18, wherein the core comprises a laminated structure.

22. The tray of claim 18, further comprising a protective layer positioned on the dielectric layer, wherein an upper surface of the protective layer is the surface on which the plurality of singulated die may be positioned.