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PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

  • US 20160172264A1
  • Filed: 02/26/2015
  • Published: 06/16/2016
  • Est. Priority Date: 12/10/2014
  • Status: Active Grant
First Claim
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1. A method for fabricating a package structure, comprising the steps of:

  • disposing at least an electronic element on a substrate and electrically connecting the electronic element and the substrate;

    forming an encapsulant on the substrate to encapsulate the electronic element; and

    forming a bright layer on the encapsulant.

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