PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
First Claim
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1. A method for fabricating a package structure, comprising the steps of:
- disposing at least an electronic element on a substrate and electrically connecting the electronic element and the substrate;
forming an encapsulant on the substrate to encapsulate the electronic element; and
forming a bright layer on the encapsulant.
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Abstract
A method for fabricating a package structure is provided, including the steps of: disposing and electrically connecting a sensing chip to a substrate; forming an encapsulant on the substrate to encapsulate the sensing chip; and forming a bright layer on the encapsulant to increase the gloss of the package structure. The encapsulant includes an additive to increase the Mohs hardness of the encapsulant. Further, the encapsulant with different additives presents different colors. Therefore, the invention obtains a high-gloss, high-hardness and colorful sensor package structure.
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Citations
23 Claims
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1. A method for fabricating a package structure, comprising the steps of:
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disposing at least an electronic element on a substrate and electrically connecting the electronic element and the substrate; forming an encapsulant on the substrate to encapsulate the electronic element; and forming a bright layer on the encapsulant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A package structure, comprising:
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a substrate; at least an electronic element disposed on and electrically connected to the substrate; an encapsulant formed on the substrate to encapsulate the electronic element; and a bright layer formed on the encapsulant. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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Specification