Pre-Applying Supporting Materials Between Bonded Package Components

• US 20160172348A1
• Filed: 02/19/2016
• Published: 06/16/2016
• Est. Priority Date: 01/23/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Hsu, Yu-Chen, Chen, Yu-feng, Pu, Han-Ping, Chen, Meng-Tse, Chen, Guan-Yu
• Granted Patent: US 10,366,971 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13664 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/14135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/2732 Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/27334 using preformed layer
• CPC Class Codes: H01L 2224/29013 being rectangular or square
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73103 Bump and layer connectors
• CPC Class Codes: H01L 2224/73104 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/83191 : wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49833 : the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

A structure includes a first package component, and a second package component over and bonded to the first package component. A supporting material is disposed in a gap between the first package component and the second package component. A molding material is disposed in the gap and encircling the supporting material.

Claims

1. A method comprising:

disposing a supporting material onto a surface of a first package component, wherein the first package component comprises a plurality of electrical connectors on the surface, wherein the plurality of electrical connectors is adjacent to peripheral regions of the first package component, and wherein the supporting material is adjacent to a center region of the surface;

after the supporting material is disposed, bonding the first package component to a second package component through the plurality of electrical connectors, with the supporting material disposed between the first package component and the second package component; and

encapsulating the supporting material and the plurality of electrical connectors in an encapsulating material, wherein the supporting material and the encapsulating material are different from each other.

2. The method of claim 1, wherein the disposing the supporting material comprises adhering an in-organic material.

3. The method of claim 1, wherein the disposing the supporting material comprises:

disposing the supporting material as a paste; and

at least partially curing the paste.

4. The method of claim 3, wherein the paste is partially cured when the encapsulating material is encapsulated.

5. The method of claim 3, wherein the paste is fully cured when the encapsulating material is encapsulated.

6. The method of claim 1, wherein the disposing the supporting material comprises adhering a solid material to the surface of the first package component.

7. The method of claim 6, wherein the solid material comprises a semiconductor material.

8. The method of claim 1, wherein after the bonding, the supporting material has a first surface in contact with the first package component, and a second surface in contact with a surface of the second package component.

9. A method comprising:

forming a plurality of composite structures identical to each other, wherein the forming each of the plurality of composite structures comprises;

disposing a supporting material to a surface of a first package component, wherein the supporting material is adjacent to a center region of the surface;

bonding the plurality of composite structures to a second package component, with the plurality of composite structures arranged as a array, wherein each of the plurality of composite structures is bonded to the second package component through a plurality of electrical connectors, and the supporting material has a surface in contact with the second package component; and

encapsulating the plurality of composite structures in an encapsulating material.

10. The method of claim 9 further comprising sawing the second package component and the encapsulating material to form a plurality of packages.

11. The method of claim 9, wherein the disposing the supporting material comprises:

disposing the supporting material as a paste; and

at least partially curing the paste.

12. The method of claim 11, wherein the paste is partially cured when the plurality of composite structures is bonded to the second package component.

13. The method of claim 11, wherein the supporting material defines a standoff distance between the first package component and the second package component.

14. The method of claim 9, wherein the encapsulating material encircles each of the plurality of electrical connectors and the supporting material.

15. A method comprising:

disposing an inorganic material onto a surface of a device die, wherein the inorganic material has a first planar surface facing the device die, and the device die comprises a plurality of solder regions surrounding the inorganic material;

bonding the device die to a package substrate through the plurality of solder regions, with a second surface of the inorganic material contacting the package substrate, wherein the plurality of solder regions are reflowed to join the device die to the package substrate; and

filling a molding compound into a gap between the device die and the package substrate.

16. The method of claim 15, wherein the disposing the inorganic material comprises:

disposing the inorganic material as a paste; and

curing the paste.

17. The method of claim 16, wherein the paste is partially cured when the molding compound is filled into the gap.

18. The method of claim 15, wherein the molding compound comprises a portion overlapping the device die.

19. The method of claim 15, wherein no solder region that is between the package substrate and the device die penetrates through the inorganic material.

20. The method of claim 15, wherein the molding compound is further molded over the device die.