III NITRIDE SEMICONDUCTOR EPITAXIAL SUBSTRATE AND III NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE, AND METHODS OF PRODUCING THE SAME
First Claim
1. A III nitride semiconductor epitaxial substrate comprising:
- a substrate of which at least a surface portion is made of AlN;
an undoped AlN layer formed on the substrate;
an Si-doped AlN buffer layer formed on the undoped AlN layer; and
a superlattice laminate formed on the Si-doped AlN buffer layer,wherein the Si-doped AlN buffer layer has an Si concentration of 2.0×
1019/cm3 or more and a thickness of 4 nm to 10 nm.
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Abstract
A III nitride semiconductor epitaxial substrate having more excellent surface flatness is provided, in which the problems of crack formation and the double peaks in the shape of the EL spectrum are mitigated by employing appropriate conditions for Si doping on an AlN layer on a substrate; a III nitride semiconductor light emitting device; and methods of producing the same. A III nitride semiconductor epitaxial substrate has a substrate of which at least a surface portion is made of AlN, an undoped AlN layer formed on the substrate, an Si-doped AlN buffer layer formed on the undoped AlN layer, and a superlattice laminate formed on the Si-doped AlN buffer layer. The Si-doped AlN buffer layer has an Si concentration of 2.0×1019/cm3 or more and a thickness of 4 nm to 10 nm.
18 Citations
9 Claims
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1. A III nitride semiconductor epitaxial substrate comprising:
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a substrate of which at least a surface portion is made of AlN; an undoped AlN layer formed on the substrate; an Si-doped AlN buffer layer formed on the undoped AlN layer; and a superlattice laminate formed on the Si-doped AlN buffer layer, wherein the Si-doped AlN buffer layer has an Si concentration of 2.0×
1019/cm3 or more and a thickness of 4 nm to 10 nm. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of producing a III nitride semiconductor epitaxial substrate, comprising the steps of:
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forming an undoped AlN layer on a substrate of which at least a surface portion is made of AN; forming an Si-doped AlN buffer layer on the undoped AlN layer; and forming a superlattice laminate on the Si-doped AlN buffer layer, wherein in the step of forming the Si-doped AlN buffer layer, Si doping is performed such that an Si concentration of 2.0×
1019/cm3 or more is achieved and a thickness of the Si-doped AlN buffer layer is 4 nm to 10 nm. - View Dependent Claims (9)
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Specification