CAMERA MODULE

• US 20160173745A1
• Filed: 02/23/2016
• Published: 06/16/2016
• Est. Priority Date: 07/30/2012
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Kim, Min Soo
• Granted Patent: US 9,917,992 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 7/04 with mechanism for focusing or varying magnification
• CPC Class Codes: G02B 7/09 adapted for automatic focusing or varying magnification
• CPC Class Codes: G03B 17/02 Bodies
• CPC Class Codes: G03B 2205/0007 Movement of one or more optical elements for control of motion blur imaging systems in general using optical elements for stabilisation of the position of the image G02B27/64
• CPC Class Codes: G03B 2205/0053 Driving means for the movement of one or more optical element
• CPC Class Codes: G03B 3/10 Power-operated focusing
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/67 Focus control based on electronic image sensor signals
• CPC Class Codes: H04N 23/687 by shifting the lens or sensor position

Abstract

A first exemplary embodiment of the present disclosure includes a PCB (Printed Circuit Board) mounted with an image sensor, a holder member mounted on the PCB, a lens module directly mounted inside the holder member, an actuator arranged at an inside of the holder member, and an electronic circuit pattern formed on a surface of the holder member to conductibly connect the PCB and the actuator, where one end of the electronic circuit pattern is connected to the PCB, and the other end of the electronic circuit pattern is connected to the actuator.

Claims

1. A camera module, the camera module comprising:

a PCB (Printed Circuit Board) mounted with an image sensor;

a holder member disposed on an upper surface of the PCB;

a lens module coupled to the holder member;

an actuator disposed on an upper surface of the holder member;

an electronic circuit pattern formed on a surface of the holder member and electrically connected with the PCB and the actuator;

a shield can disposed outside of the holder member and spaced from the electronic circuit pattern; and

a first insulation member disposed between the shield can and the electronic circuit pattern.

2. The camera module of claim 1, wherein an upper surface of the lens module is positioned at a height corresponding with that of an upper surface of the holder member.

3. The camera module of claim 2, wherein a bottom surface of the actuator is contacted with the upper surface of the lens module, and

wherein the electronic circuit pattern formed on the upper surface of the holder member is connected with a bottom end of a lateral surface of the actuator.

4. The camera module of claim 3, further comprising:

a protective guide member disposed between the upper surface of the holder member and an inner surface of an upper plate of the shield can, and

a second insulation member disposed between the shield can and the protective guide member.

5. The camera module of claim 4, wherein an upper surface of the protective guide member is positioned upper than an upper surface of the actuator.

6. The camera module of claim 2, wherein a bottom surface of the actuator is contacted with the upper surface of the lens module and the upper surface of the holder member, and

wherein the electronic circuit pattern formed on the upper surface of the holder member is connected with a bottom surface of the actuator.

7. The camera module of claim 6, wherein an upper surface of the actuator is positioned lower than an inner surface of an upper plate of the shield can, and

wherein a portion of the actuator is overlapped with the upper plate of the shield can in an up-down direction.

8. The camera module of claim 1, wherein the lens module includes at least one lens and a lens barrel accommodating the lens.

9. The camera module of claim 1, wherein the lens module includes at least one lens directly mounted to the holder member.

10. The camera module of claim 1, wherein the insulation member includes an epoxy.

11. The camera module of claim 1, wherein the actuator includes any one of a MEMS (Micro Electric Mechanical System) actuator moved by using an electrostatic force and a piezoelectric force, a liquid crystal lens, a piezoelectric polymer lens, a non-MEMS actuator, a silicon type actuator, and a liquid lens, or a combination of at least two such actuators.

12. The camera module of claim 1, wherein the actuator performs an auto focusing function or a handshake compensation function through changes in thickness or shape of a fixed lens or changes in refractive indexes of incident light.

13. The camera module of claim 1, wherein the electronic circuit pattern and the actuator are connected using a soldering, an Ag epoxy, a conductive epoxy or a wire bonding.

14. An optical apparatus, the optical apparatus comprising:

a PCB (Printed Circuit Board) mounted with an image sensor;

a holder member disposed on an upper surface of the PCB;

a lens module coupled to the holder member;

an actuator disposed on an upper surface of the holder member;

an electronic circuit pattern formed on a surface of the holder member and electrically connected with the PCB and the actuator;

a shield can disposed outside of the holder member and spaced from the electronic circuit pattern; and

a first insulation member disposed between the shield can and the electronic circuit pattern.