SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME

• US 20160181454A1
• Filed: 12/22/2015
• Published: 06/23/2016
• Est. Priority Date: 12/22/2014
• Status: Abandoned Application

• Current Assignee: LG Electronics, Inc. (LG Corporation)
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: LIM, Kwangyoung, SON, Jeonghun, MOON, Kangseok, AHN, Sehwon
• Application Number:
  US14/978,905
• Publication Number:
  US 20160181454A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 31/022441 Electrode arrangements specially adapted for back-contact solar cells
• CPC Class Codes: H01L 31/048 Encapsulation of modules
• CPC Class Codes: H01L 31/0516 specially adapted for interconnection of back-contact solar cells
• CPC Class Codes: H01L 31/0682 back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
• CPC Class Codes: Y02E 10/547 Monocrystalline silicon PV cells

Abstract

A solar cell module and a method for manufacturing the same are discussed. The solar cell module includes a front transparent substrate and a back substrate positioned opposite each other, a plurality of solar cells positioned between the front transparent substrate and the back substrate, each solar cell including a semiconductor substrate and first and second electrodes, the first and second electrodes being separated from each other on a back surface of the semiconductor substrate and each extending in a first direction, a first conductive line connected to the first electrode included in the each solar cell through a conductive adhesive, a second conductive line connected to the second electrode included in the each solar cell through the conductive adhesive, a first encapsulant positioned between the solar cells and the front transparent substrate, and a second encapsulant positioned between the solar cells and the back substrate.

Claims

1. A solar cell module comprising:

a front transparent substrate and a back substrate positioned opposite each other;

a plurality of solar cells positioned between the front transparent substrate and the back substrate, each solar cell including a semiconductor substrate and first and second electrodes, the first and second electrodes being separated from each other on a back surface of the semiconductor substrate and each extending in a first direction;

a first conductive line connected to the first electrode included in the each solar cell through a conductive adhesive;

a second conductive line connected to the second electrode included in the each solar cell through the conductive adhesive;

a first encapsulant of an insulating material positioned between the plurality of solar cells and the front transparent substrate; and

a second encapsulant of an insulating material positioned between the plurality of solar cells and the back substrate,

wherein the second encapsulant is filled in a space between the first electrode of the each solar cell and the second conductive line and a space between the second electrode of the each solar cell and the first conductive line.

2. The solar cell module of claim 1, wherein the second encapsulant is further filled in a space between the first electrode and the second electrode in the each solar cell.

3. The solar cell module of claim 1, wherein the first and second conductive lines are separated from each other and each of the first and second conductive lines extends in a second direction crossing the first direction.

4. The solar cell module of claim 1, wherein a thickness of the conductive adhesive is greater than a thickness of each of the first and second electrodes.

5. The solar cell module of claim 4, wherein a thickness of each of the first and second conductive lines is greater than the thickness of the conductive adhesive.

6. The solar cell module of claim 4, wherein the thickness of the each of the first and second electrodes is 0.2 μ

m to 1 μ

m.

7. The solar cell module of claim 4, wherein the thickness of the conductive adhesive is 50 μ

m to 150 μ

m.

8. The solar cell module of claim 5, wherein the thickness of the each of the first and second conductive lines is 180 μ

m to 220 μ

m.

9. The solar cell module of claim 1, wherein each of the first and second conductive lines includes a core and a coating layer coated on a surface of the core, and

wherein a melting point of the coating layer is lower than a melting point of the core.

10. The solar cell module of claim 9, wherein the conductive adhesive includes metal particles having a melting point that is higher than the melting point of the coating layer and is lower than the melting point of the core.

11. The solar cell module of claim 10, wherein the metal particles include first metal particles having a melting point higher than 160°

C.

12. The solar cell module of claim 11, wherein the metal particles include second metal particles having a melting point higher than the melting point of the first metal particles.

13. The solar cell module of claim 12, wherein an amount of the first metal particles is greater than an amount of the second metal particles.

14. The solar cell module of claim 12, wherein the conductive adhesive includes an intermetallic compound, that is chemically bonded by melting surfaces of the first and second metal particles, between the first and second metal particles.

15. The solar cell module of claim 9, wherein the melting point of the coating layer is 110°

C. to 160°

C.

16. The solar cell module of claim 1, wherein a melting point of the second encapsulant is 70°

C. to 100°

C.

17. The solar cell module of claim 1, wherein the second encapsulant includes at least one of ethylene vinyl acetate (EVA), polyolefin, ionomer, or poly vinyl butyral (PVB).

18. The solar cell module of claim 1, wherein the plurality of solar cells include a first solar cell and a second solar cell, and

wherein a first conductive line connected to a first electrode of the first solar cell and a second conductive line connected to a second electrode of the second solar cell are positioned between semiconductor substrates of the first and second solar cells and are connected to an interconnector extending in the first direction.

19. A method for manufacturing a solar cell module, the method comprising:

preparing a solar cell, in which first and second electrodes are formed on a back surface of a semiconductor substrate of the solar cell;

a conductive adhesive forming operation of applying a conductive adhesive paste on each of the first and second electrodes and curing the conductive adhesive paste through thermal processing to form a conductive adhesive;

temporarily bonding a first conductive line including a coating layer having a melting point lower than a melting point of the cured conductive adhesive to the first electrode and temporarily bonding a second conductive line including a coating layer having a melting point lower than a melting point of the cured conductive adhesive to the second electrode;

a disposition operation of disposing a front transparent substrate on a front surface of the solar cell, disposing a back substrate on a back surface of the solar cell, disposing a first encapsulant between the front transparent substrate and the solar cell, and disposing a second encapsulant between the back substrate and the solar cell; and

a lamination operation of, after the disposition operation, performing a pressurization process and a thermal process to fill the second encapsulant between the first and second electrodes.

20. The method of claim 19, wherein the lamination operation includes filling the second encapsulant between the first electrode and the second conductive line and between the second electrode and the first conductive line.

21. The method of claim 19, wherein the solar cell includes a first solar cell and a second solar cell, the method further comprising disposing an interconnector between the first solar cell and the second solar cell that are positioned adjacent to each other, a first conductive line connected to the first solar cell and a second conductive line connected to the second solar cell being commonly connected to the interconnector.

22. The method of claim 19, wherein a temperature of the thermal processing in the conductive adhesive forming operation is higher than a temperature of the thermal process in the lamination operation.