Solid-State Batteries with Improved Performance and Reduced Manufacturing Costs and Methods for Forming the Same

• US 20160181615A1
• Filed: 12/19/2014
• Published: 06/23/2016
• Est. Priority Date: 12/19/2014
• Status: Abandoned Application

• Current Assignee: Intermolecular Incorporated
• Original Assignee: Intermolecular Incorporated
• Inventors: Van Duren, Jeroen, Anapolsky, Abraham
• Application Number:
  US14/577,774
• Publication Number:
  US 20160181615A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01M 10/052 Li-accumulators
• CPC Class Codes: H01M 10/0562 Solid materials
• CPC Class Codes: H01M 10/058 Construction or manufacture
• CPC Class Codes: H01M 2220/30 Batteries in portable systems, e.g. mobile phone, laptop
• CPC Class Codes: H01M 4/621 Binders
• CPC Class Codes: H01M 4/661 Metal or alloys, e.g. alloy coatings H01M4/669 take precedence
• CPC Class Codes: H01M 4/662 Alloys collectors of lead alloys H01M4/685
• CPC Class Codes: Y02E 60/10 Energy storage using batteries

Abstract

Embodiments provided herein describe solid-state lithium batteries and methods for forming such batteries. A layer stack may be formed between a substrate of the batteries and a current collector of the batteries. A texturing may be provided to at least one of the components of the batteries to increase the interfacial area between the components. At least one of conductive metal oxides, conductive metal nitrides, conductive metal carbides, or a combination thereof may be used to form a current collector of the batteries.

Claims

1. A method for forming a solid-state lithium battery, the method comprising:

providing a substrate;

forming a diffusion barrier layer above the substrate, wherein the diffusion barrier layer comprises at least one of tantalum, titanium, chromium, molybdenum, zinc, tin, cadmium, or a combination thereof;

forming at least one adhesion layer above the substrate, wherein the at least one adhesion layer is made of a material different than that of the diffusion barrier layer and comprises at least one of titanium, chromium, or a combination thereof;

forming a first current collector above the diffusion barrier layer and the at least one adhesion layer;

forming a first electrode above the first current collector;

forming an electrolyte above the first electrode;

forming a second electrode above the electrolyte; and

forming a second current collector above the second electrode.

2. The method of claim 1, wherein the substrate comprises an electrically conductive material.

3. The method of claim 2, wherein the substrate comprises at least one of aluminum, copper, steel, or a cladded foil.

4. The method of claim 3, wherein the diffusion barrier layer has a thickness of between about 100 nanometers (nm) and about 1000 nm.

5. The method of claim 4, wherein the at least one adhesion layer comprises a first adhesion layer and a second adhesion layer, and wherein the diffusion barrier layer is formed above the first adhesion layer, and the second adhesion layer is formed above the diffusion barrier layer.

6. The method of claim 5, wherein each of the first adhesion layer and the second adhesion layer has a thickness of between about 1 nm and about 50 nm.

7. The method of claim 6, wherein the diffusion barrier layer comprises at least one of tantalum nitride, titanium nitride, titanium oxynitride, or a combination thereof, and each of the first adhesion layer and the second adhesion layer comprises titanium.

8. The method of claim 1, further comprising forming a surface roughness on at least one of the substrate, the diffusion barrier layer, the at least one adhesion layer, the first current collector, the first electrode, the electrolyte, the second electrode, or the second current collector.

9. The method of claim 8, wherein the forming of the surface roughness on the at least one of the substrate, the diffusion barrier layer, the at least one adhesion layer, the first current collector, the first electrode, the electrolyte, the second electrode, or the second current collector comprises performing an etching process on at least one of the substrate, the diffusion barrier layer, the at least one adhesion layer, or the first current collector.

10. The method of claim 1, wherein the first current collector comprises at least one of fluorine-doped tin oxide, titanium nitride, tantalum nitride, indium tin oxide, indium zinc oxide, or a combination thereof.

11. A method for forming a solid-state lithium battery, the method comprising:

providing a substrate, wherein the substrate comprises an electrically conductive material;

forming a first adhesion layer above the substrate, wherein the first adhesion layer comprises at least one of titanium, chromium, or a combination thereof;

forming a diffusion barrier layer above the first adhesion layer, wherein the diffusion barrier layer comprises at least one of tantalum, titanium, chromium, molybdenum, zinc, tin, cadmium, or a combination thereof;

forming a second adhesion layer above the diffusion barrier layer, wherein the second adhesion layer comprises at least one of titanium, chromium, or a combination thereof,

wherein the first adhesion layer and the second adhesion layer are each made of a material different than that of the diffusion barrier layer;

forming a first current collector above the second adhesion layer;

forming a first electrode above the first current collector;

forming an electrolyte above the first electrode;

forming a second electrode above the electrolyte; and

forming a second current collector above the second electrode.

12. The method of claim 11, wherein the diffusion barrier layer has a thickness of between about 100 nanometers (nm) and about 1000 nm.

13. The method of claim 12, wherein each of the first adhesion layer and the second adhesion layer has a thickness of between about 1 nm and about 50 nm.

14. The method of claim 13, wherein the first current collector comprises at least one of fluorine-doped tin oxide, titanium nitride, tantalum nitride, indium tin oxide, indium zinc oxide, or a combination thereof.

15. The method of claim 14, further comprising forming a surface roughness on at least one of the substrate, the first adhesion layer, the diffusion barrier layer, the second adhesion layer, the first current collector, the first electrode, the electrolyte, the second electrode, or the second current collector.

16. A solid-state lithium battery comprising:

a substrate;

a diffusion barrier layer formed above the substrate, wherein the diffusion barrier layer comprises at least one of tantalum, titanium, chromium, molybdenum, zinc, tin, cadmium, or a combination thereof;

at least one adhesion layer formed above the substrate, wherein the at least one adhesion layer is made of a material different than that of the diffusion barrier layer and comprises at least one of titanium, chromium, or a combination thereof;

a first current collector formed above the diffusion barrier layer and the at least one adhesion layer;

a first electrode formed above the first current collector;

an electrolyte formed above the first electrode;

a second electrode formed above the electrolyte; and

a second current collector formed above the second electrode.

17. The solid-state battery of claim 16, wherein the substrate comprises an electrically conductive material.

18. The solid-state battery of claim 17, wherein the at least one adhesion layer comprises a first adhesion layer and a second adhesion layer, and wherein the diffusion barrier layer is formed above the first adhesion layer, and the second adhesion layer is formed above the diffusion barrier layer.

19. The solid-state battery of claim 18, wherein the diffusion barrier layer has a thickness of between about 100 nanometers (nm) and about 1000 nm, and wherein each of the first adhesion layer and the second adhesion layer has a thickness of between about 1 nm and about 50 nm.

20. The solid-state battery of claim 19, wherein the first current collector comprises at least one of fluorine-doped tin oxide, titanium nitride, tantalum nitride, indium tin oxide, indium zinc oxide, or a combination thereof.