INSOLE WITH HEAT GENERATED BY PRESSING SYSTEM

• US 20160183629A1
• Filed: 12/25/2014
• Published: 06/30/2016
• Est. Priority Date: 12/25/2014
• Status: Abandoned Application

• Current Assignee: Chih-Hua Hsieh
• Original Assignee: Chih-Hua Hsieh
• Inventors: Hsieh, Chih-Hua
• Application Number:
  US14/583,123
• Publication Number:
  US 20160183629A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A43B 17/00 Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined
• CPC Class Codes: A43B 3/35 with electric heating arrangements
• CPC Class Codes: A43B 3/38 with power sources

Abstract

An objective of the present invention lies in providing an insole with heat generated by pressing system, which can keep warm for wear'"'"'s feet easily and safely even in the low temperature. The technical solution is that an insole with heat generated by pressing system comprising an insole, a power pressing module disposed inside the insole and electrically connected with each other to form an electrical circuit, two flexible conductive strips, and at least one resistance heating chip; said power pressing module providing power generated ay pressure, which is arranged in a heel cup of the insole, sequentially comprising a first conductive layer, a first composite sintered body, a second conductive layer, and a second composite sintered body, and an insulated strip arranged between the first conductive layer and the second conductive layer and surrounded the first composite sintered body.

Claims

1. An insole with heat generated by pressing system comprising an insole (1), a power pressing module (2) disposed inside the insole (1) and electrically connected with each other to form an electrical circuit, two flexible conductive strips (3), and at least one resistance heating chip (4);

said power pressing module (2) providing power generated by pressure, which is arranged in a heel cup of the insole (1), sequentially comprising a first conductive layer (21), a first composite sintered body (22), a second conductive layer (23), and a second composite sintered body (24), and an insulated strip (25) arranged between the first conductive layer (21) and the second conductive layer (23) and surrounded the first composite sintered body (22), the first conductive layer (21) and the second composite sintered body (24) electrically connected with one of the two flexible conductive strips (3);

said resistance heating chip (4) having a welding part on a surface thereof, which is electrically connected with a free end of the two flexible conductive strips (3) by a welding method, said free end arranged between the two flexible conductive strips (3) and disposed at a forefoot of the insole (1).

2. The device of claim 1, wherein both the first conductive layer (21) and the second conductive layer (23) are made of copper conductive bodies, and both the first composite sintered body (22) and the second composite sintered body (24) are mixed and sintered from sodium tartrate, quartz, and ceramic.

3. The device of claim 2, wherein the two flexible conductive strips (3) are made integrally into one piece in an edge of the free end.

4. The device of claim 1, wherein the insole (1) includes an upper layer body (11), a lower layer body (12) corresponded to the upper layer body (11) and disposed at a bottom side thereof, and an adhesive layer body (13) arranged between the upper layer body (11) and the lower layer body (12), said adhesive layer body (13) configured to connect with the upper layer body (11) and the lower layer body (12) to fix the power pressing (2), the flexible conductive strips (3) and the resistance heating chip (4).

5. The device of claim 4, wherein the upper layer body (11) corresponded to the second composite sintered body (24) includes a first insulated sticker (5), said first insulates sticker (5) corresponded to the first conductive layer (21) including a second insulated sticker (6).