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Method and Apparatus for RFID Tag Testing

  • US 20160187380A1
  • Filed: 03/09/2016
  • Published: 06/30/2016
  • Est. Priority Date: 08/24/2012
  • Status: Active Grant
First Claim
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1. A semiconductor wafer comprising:

  • a plurality of dies, each of the plurality of dies comprising a radio frequency identification (RFID) tag circuit; and

    at least one test probe comprising a plurality of probe pads, the plurality of probe pads being configured to transmit power signals, data signals and control signals to each of the plurality of dies, and to receive test results from each of the plurality of dies, the data signals, the control signals and the test results being transmitted serially from one of the plurality of dies to another of the plurality of dies.

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