Method and Apparatus for RFID Tag Testing
First Claim
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1. A semiconductor wafer comprising:
- a plurality of dies, each of the plurality of dies comprising a radio frequency identification (RFID) tag circuit; and
at least one test probe comprising a plurality of probe pads, the plurality of probe pads being configured to transmit power signals, data signals and control signals to each of the plurality of dies, and to receive test results from each of the plurality of dies, the data signals, the control signals and the test results being transmitted serially from one of the plurality of dies to another of the plurality of dies.
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Abstract
A semiconductor wafer includes a plurality of dies and at least one test probe. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit. The at least one test probe includes a plurality of probe pads. The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies, and to receive test results from each of the plurality of dies. The data are transmitted to each of the plurality of dies in a serial manner. The test results of each of the plurality of dies are also transmitted to the plurality of probe pads in a serial manner.
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Citations
20 Claims
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1. A semiconductor wafer comprising:
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a plurality of dies, each of the plurality of dies comprising a radio frequency identification (RFID) tag circuit; and at least one test probe comprising a plurality of probe pads, the plurality of probe pads being configured to transmit power signals, data signals and control signals to each of the plurality of dies, and to receive test results from each of the plurality of dies, the data signals, the control signals and the test results being transmitted serially from one of the plurality of dies to another of the plurality of dies. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor wafer comprising:
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a plurality of dies, each of the plurality of dies comprising a radio frequency identification (RFID) tag circuit, the plurality of dies being serially connected to each other to form a die chain; a plurality of scribe regions, each of the plurality of scribe regions being interposed between corresponding adjacent dies; a plurality of conductive lines disposed in the scribe regions, adjacent dies in the die chain being electrically coupled using at least one of the plurality of conductive lines; and a test probe electrically coupled to the die chain using at least one of the plurality of conductive lines, the test probe comprising a plurality of probe pads, the plurality of probe pads being configured to transmit data signals and control signals through the die chain. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A semiconductor wafer comprising:
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a plurality of dies, each of the plurality of dies comprising a radio frequency identification (RFID) tag circuit, the plurality of dies being coupled to form a plurality of die chains, each one of the die chains comprising serially connected dies; and a test probe electrically coupled to the plurality of the die chains, the test probe comprising; first probe pads, the first probe pads being configured to transmit data signals and control signals through the plurality of die chains; and second probe pads, the second probe pads being configured to transmit power signals through the plurality of die chains. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification