METHOD AND SYSTEM FOR DETECTING DEFECTS

• US 20160189369A1
• Filed: 12/14/2015
• Published: 06/30/2016
• Est. Priority Date: 12/31/2014
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: JUNG, Jae-Ouk, KO, Woo-Seok, YANG, Yu-Sin, LEE, Sang-Kil, JUN, Chung-Sam
• Application Number:
  US14/967,943
• Publication Number:
  US 20160189369A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G02B 21/0028 specially adapted for specific applications, e.g. for endoscopes, ophthalmoscopes, attachments to conventional microscopes
• CPC Class Codes: G02B 21/0056 based on optical coherence, e.g. phase-contrast arrangements, interference arrangements
• CPC Class Codes: G02B 21/008 Details of detection or image processing, including general computer control
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/0006 using a design-rule based approach
• CPC Class Codes: G06T 7/001 using an image reference approach

Abstract

A defect detecting method includes generating an actual image of a pattern on a sample based on irradiation of an electron beam onto the sample, performing a contrast conversion of the actual image to generate a conversion image representing a normal pattern, matching the conversion image and a design image for the pattern, and detecting a defective pattern in the actual image based on matching of the conversion image and the design image. The contrast conversion may be performed for gray levels of pixels in the actual image.

Claims

1. A defect detecting method, the method comprising:

generating an actual image of a pattern on a sample based on irradiation of an electron beam onto the sample;

performing a contrast conversion of the actual image to generate a conversion image representing a normal pattern, the contrast conversion performed for gray levels of pixels in the actual image;

matching the conversion image and a design image for the pattern; and

detecting a defective pattern in the actual image based on matching of the conversion image and the design image.

2. The method as claimed in claim 1, wherein the actual image is a scanning electron microscope (SEM) image generated based on detection of secondary electrons emitted from the sample.

3. The method as claimed in claim 1, wherein the contrast conversion includes converting the gray levels of pixels equal to or less than a predetermined gray level in the actual image to a gray level of zero.

4. The method as claimed in claim 1, further comprising:

adjusting brightness or Gaussian blur of the conversion image to generate a corrected conversion image.

5. The method as claimed in claim 4, wherein matching the conversion image and the design image for the pattern includes matching the corrected conversion image and the design image for the pattern.

6. The method as claimed in claim 1, wherein the sample includes a material layer having a contact hole.

7. The method as claimed in claim 1, wherein the design image is a graphic data system (GDS) image.

8. A defect detecting method, the method comprising:

generating an actual image of a sample having a pattern based on irradiation of an electron beam onto the sample;

performing a contrast conversion to generate a conversion image representing a normal pattern, the contrast conversion performed for gray levels of pixels in the actual image;

generating a corrected conversion image based on an adjustment of brightness or Gaussian blur of the conversion image; and

matching the corrected conversion image and a design image for the pattern to detect a defective pattern in the actual image.

9. The method as claimed in claim 8, wherein the actual image is a scanning electron microscope (SEM) image generated based on detection of secondary electrons emitted from the sample.

10. The method as claimed in claim 8, wherein the contrast conversion includes converting pixels having gray levels of a predetermined level or less in the actual image to have a gray level of zero.

11. The method as claimed in claim 8, wherein the sample includes a material layer having a contact hole.

12. The method as claimed in claim 8, wherein the design image includes a graphic data system (GDS) image.

13. A defect detecting system, comprising:

an electron microscope irradiating an electron beam onto a sample having a pattern;

a detector to detect electrons emitted from the pattern to obtain an actual image for the pattern; and

an image processor connected to the electron microscope, the image processor including;

image converting logic to convert the actual image to a conversion image representing normal patterns, the image converting logic to perform a contrast conversion with respect to gray levels of pixels in the actual image, and

matching logic to match the conversion image and a design image for the pattern to detect a defective pattern in the actual image.

14. The system as claimed in claim 13, wherein the image converting logic includes:

a converter to convert pixel values having gray levels of a predetermined level or less in the actual image to zero to create the conversion image; and

a corrector to adjust brightness or Gaussian blur of the conversion image to create a corrected conversion image.

15. The system as claimed in claim 14, wherein the matching logic is to match the corrected conversion image and the design image for the pattern to detect a defective pattern.

16. A defect detecting method, the method comprising:

receiving a first image of a pattern on a sample;

converting the first image to a second image including a normal pattern, the first image converted by converting gray levels of pixels in the first image that are equal to or less than a predetermined level to a predetermined value;

matching the second image and a design image for the pattern; and

detecting a defect in the first image based on results of the matching.

17. The defect detecting method as claimed in claim 16, wherein the predetermined value is a gray level equal to zero.

18. The defect detecting method as claimed in claim 16, further comprising:

adjusting brightness or Gaussian blur of the second image before matching the second image and the design image.

19. The defecting detecting method as claimed in claim 16, wherein:

the sample includes a semiconductor device, and

the defect corresponds to a defect of a contact hole in the semiconductor device.