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CO-INTEGRATED BULK ACOUSTIC WAVE RESONATORS

  • US 20160191017A1
  • Filed: 06/26/2014
  • Published: 06/30/2016
  • Est. Priority Date: 06/26/2013
  • Status: Active Grant
First Claim
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1. An electrical circuit assembly, comprising:

  • a semiconductor integrated circuit; and

    a first lateral-mode resonator fabricated upon a surface of a semiconductor integrated circuit, the first lateral-mode resonator comprising;

    a deposited acoustic energy storage layer including a semiconductor material;

    a deposited piezoelectric layer acoustically coupled to the deposited acoustic energy storage layer; and

    a first conductive region electrically coupled to the deposited piezoelectric layer and electrically coupled to the semiconductor integrated circuit;

    wherein the semiconductor integrated circuit includes one or more transistor structures.

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