METHOD FOR REDUCING BOW IN LAMINATE STRUCTURE
First Claim
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1. A method for making a laminate structure, comprising:
- positioning an interlayer between a first substrate and a second substrate to form a stack;
heating the stack to a lamination temperature to form a laminate structure; and
subjecting the laminate structure to at least one thermal cycle,wherein the thermal cycle comprises cooling the laminate structure to a first temperature ranging from about −
20°
C. to about 35°
C., and heating the laminate structure to a second temperature below the lamination temperature, the second temperature ranging from about 50°
C. to about 120°
C., and wherein a coefficient of thermal expansion of the first substrate is different than a coefficient of thermal expansion of the second substrate.
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Abstract
Disclosed herein are methods for making asymmetric laminate structures and methods for reducing bow in asymmetric laminate structures, the methods comprising subjecting the laminate structures to at least one thermal cycle comprising cooling the laminate structures to a first temperature near or below room temperature and heating the laminate structures to a second temperature near or below the lamination temperature. Also disclosed herein are laminate structures made according to such methods.
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Citations
28 Claims
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1. A method for making a laminate structure, comprising:
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positioning an interlayer between a first substrate and a second substrate to form a stack; heating the stack to a lamination temperature to form a laminate structure; and subjecting the laminate structure to at least one thermal cycle, wherein the thermal cycle comprises cooling the laminate structure to a first temperature ranging from about −
20°
C. to about 35°
C., and heating the laminate structure to a second temperature below the lamination temperature, the second temperature ranging from about 50°
C. to about 120°
C., and wherein a coefficient of thermal expansion of the first substrate is different than a coefficient of thermal expansion of the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A laminate structure comprising a first glass substrate, a second glass substrate, and an interlayer attaching the first and second glass substrates,
wherein a minimum radius of curvature of the laminate structure at a temperature ranging from about − - 20°
C. to about 90°
C. is at least about 30 times greater than a maximum dimension of the laminate structure, andwherein a coefficient of thermal expansion of the first glass substrate is at least about 30% greater than a coefficient of thermal expansion of the second glass substrate. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. A method for reducing bow in a laminate structure, comprising:
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subjecting the laminate structure to at least one thermal cycle comprising cooling the laminate structure to a first temperature ranging from about −
20°
C. to about 35°
C. and heating the laminate structure to a second temperature ranging from about 50°
C. to about 120°
C.;wherein the laminate comprises a first substrate and second substrate attached with an interlayer, and wherein a coefficient of thermal expansion of the first substrate is different than a coefficient of thermal expansion of the second substrate. - View Dependent Claims (23, 24, 25, 26, 27, 28)
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Specification