SUBSTRATE CARRIER WITH INTEGRATED ELECTROSTATIC CHUCK

• US 20160196997A1
• Filed: 09/18/2014
• Published: 07/07/2016
• Est. Priority Date: 09/20/2013
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: WHITE, John M., WANG, Zuoqian
• Granted Patent: US 10,297,483 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 14/12 Organic material
• CPC Class Codes: C23C 14/24 Vacuum evaporation
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: C23C 14/541 Heating or cooling of the substrates
• CPC Class Codes: C23C 14/562 for coating elongated substrates
• CPC Class Codes: C23C 16/042 using masks
• CPC Class Codes: C23C 16/345 Silicon nitride
• CPC Class Codes: C23C 16/401 containing silicon
• CPC Class Codes: C23C 16/45578 Elongated nozzles, tubes with holes
• CPC Class Codes: C23C 16/4587 the substrate being supported substantially vertically
• CPC Class Codes: C23C 16/463 Cooling of the substrate
• CPC Class Codes: C23C 16/545 for coating elongated substrates
• CPC Class Codes: F26B 3/00 Drying solid materials or objects by processes involving the application of heat in specific machines or apparatus F26B9/00 - F26B19/00
• CPC Class Codes: F27B 1/08 heated otherwise than by solid fuel mixed with charge
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/6732 Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
• CPC Class Codes: H01L 21/67706 Mechanical details, e.g. roller, belt H01L21/67709 takes precedence
• CPC Class Codes: H01L 21/67712 the substrate being handled substantially vertically
• CPC Class Codes: H01L 21/67718 Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
• CPC Class Codes: H01L 21/67742 : Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/6833 : Details of electrostatic chucks
• CPC Class Codes: H05B 3/03 : Electrodes

Abstract

A substrate carrier adapted to use in a processing system includes an electrode assembly and a support base. The electrode assembly is configured to generate an electrostatic chucking force for securing a substrate to the substrate carrier. The support base has a heating/cooling reservoir formed therein. The electrode assembly and the support base form an unitary body configured for transport within a processing system. A quick disconnect is coupled to the body and configured to trap a heat regulating medium in the reservoir heating/cooling reservoir when the body is decoupled from a source of heat regulating medium.

Claims

12. A processing system, comprising:

(a) a substrate carrier comprising;

an electrode assembly configured to generate an electrostatic chucking force and a support base having a heating/cooling reservoir formed therein, the electrode assembly and support base forming an unitary body configured for transport within a processing system; and

a connector coupled to the support base and configured to transfer a heat regulating medium into the heating/cooling reservoir.

(b) a processing chamber adapted to receive the carrier with a substrate electrostatically coupled thereon; and

(c) a mating connector operable to automatically couple to the connector of the support base.

13. The substrate carrier of claim 12, further comprising:

a controller on-board the substrate carrier, the controller adapted to control a state of each electrode assembly.

14. The substrate carrier of claim 12, further comprising:

an actuator configured to couple and decouple the connector and mating connector.

15. A method for transporting a substrate in a processing system, the method comprising:

transferring a substrate onto a substrate carrier;

providing a heat transfer medium to a heating/cooling reservoir formed in the substrate carrier;

electrostatically chucking the substrate to the substrate carrier;

decouping a source of heat transfer medium from the substrate carrier; and

transferring the substrate while electrostatically chucked to the substrate carrier.

1. A substrate carrier adapted to use in a processing system, the substrate carrier comprising:

an electrode assembly configured to generate an electrostatic chucking force;

a support base having a heating/cooling reservoir formed therein, the electrode assembly and support base forming an unitary body configured for transport within a processing system; and

a connector coupled to the support base and configured to transfer a heat regulating medium into the heating/cooling reservoir.

2. The substrate carrier of claim 1, further comprising:

an energy storage device disposed on-board the substrate carrier and coupled to the electrode assembly.

3. The substrate carrier of claim 1, further comprising:

a passage exiting a substrate supporting surface of the body;

an integral check valve formed in the connector coupled to the passage.

4. The substrate carrier of claim 3, further comprising:

a sealing ridge, elastomeric seal or o-ring projecting above the substrate supporting surface of the body outward of the passage.

5. The substrate carrier of claim 1 further comprising:

a rail extending from a side of the body.

6. The substrate carrier of claim 5, wherein the rail is configured to interface with a drive system adapted to transport the body through the system.

7. The substrate carrier of claim 2, wherein the energy storage device further comprises:

at least one of a battery, capacitor, supercapacitor and ultrabattery.

8. The substrate carrier of claim 1, wherein the electrode assembly comprises:

a plurality of distributed electrodes.

9. The substrate carrier of claim 1, wherein the distributed electrodes further comprises:

at least a first electrode interleaving with a second electrode.

10. The substrate carrier of claim 9, wherein the first electrode has a plurality of fingers interleaving with interleaving with a plurality of fingers of the second electrode.

11. The substrate carrier of claim 1, wherein the electrode assembly comprises:

an array of independently controllable electrode assemblies

16. The processing system of claim 15, wherein the mating connector is located in at least one of a loading station, a load lock chamber and a processing chamber.

17. The method of claim 16, further comprising:

trapping the temperature regulating fluid inside the substrate carrier.

18. The method of claim 19, further comprising:

automatically disconnecting a power source from the substrate carrier in a processing chamber or in a substrate loading station.

19. The method of claim 15, further comprising:

automatically connecting a power source to the substrate carrier while the substrate carrier is in at least one of a processing chamber, a load lock chamber or in a substrate loading station.

20. The method of claim 15, wherein transferring the substrate further comprises:

transferring the substrate carrier in a substantially vertical orientation into a processing chamber.

16-1. The method of claim 15, further comprising:

supplying a temperature regulating fluid into heating/cooling reservoir formed in the substrate carrier while the carrier is positioned in a processing chamber.