CARRIER WITH HEAT DISSIPATION STRUCTURE

• US 20160201994A1
• Filed: 01/12/2015
• Published: 07/14/2016
• Est. Priority Date: 01/12/2015
• Status: Abandoned Application

• Current Assignee: Asia Vital Components Company Limited
• Original Assignee: Asia Vital Components Company Limited
• Inventors: Shen, Ching-Hang
• Application Number:
  US14/594,181
• Publication Number:
  US 20160201994A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: F28F 13/182 especially adapted for evaporator or condenser surfaces F28F13/187 takes precedence
• CPC Class Codes: G04G 17/08 Housings
• CPC Class Codes: G06F 1/163 Wearable computers, e.g. on a belt
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H04B 2001/3861 carried in a hand or on fingers
• CPC Class Codes: H04M 1/04 Supports for telephone transmitters or receivers

Abstract

A carrier with heat dissipation structure includes a main body. The main body is made of silicone or rubber material. The main body has a chamber having a capillary structure. A working fluid is contained in the chamber. At least one support section protrudes from a wall face of the chamber. The main body has at least one heat absorption section and a heat dissipation section. The heat dissipation section extends from at least one end of the heat absorption section. The carrier of the present invention is flexible. The carrier has an internal chamber for vapor-liquid circulation and heat exchange of the working fluid. Accordingly, the heat dissipation efficiency of the intelligent mobile device correspondingly assembled with the carrier is greatly enhanced.

Claims

1. A carrier with heat dissipation structure comprising a main body, the main body being made of silicone or rubber material, the main body having a chamber having a capillary structure, a working fluid being contained in the chamber, a support section protruding from a wall face of the chamber, the main body having at least one heat absorption section and a heat dissipation section, the heat dissipation section extending from at least one end of the heat absorption section.

2. The carrier with heat dissipation structure as claimed in claim 1, wherein the capillary structure is selected from a group consisting of mesh body, fiber body and metal wire braided body.

3. The carrier with heat dissipation structure as claimed in claim 1, wherein the main body further has a rest section correspondingly assembled with the heat absorption section, the rest section having a receiving space, whereby at least one intelligent mobile device can be correspondingly connected and assembled in the receiving space.

4. The carrier with heat dissipation structure as claimed in claim 1, wherein the support section is composed of multiple ribs arranged at intervals.

5. The carrier with heat dissipation structure as claimed in claim 1, further comprising a heat conductor inlaid in the heat absorption section of the main body, the heat conductor having a first face and a second face, the first face being exposed to outer side of the main body, the second face facing the chamber of the main body, the capillary structure extending to a position adjacent to the second face of the heat conductor, the heat conductor being selected from a group consisting of a heat pipe, a vapor chamber and a graphite sheet.

6. The carrier with heat dissipation structure as claimed in claim 1, wherein the support section is composed of multiple raised bodies arranged at intervals.

7. The carrier with heat dissipation structure as claimed in claim 1, wherein the chamber of the main body further has a coating therein.