TEMPERATURE SENSOR AND MANUFACTURING METHOD THEREFOR

• US 20160209277A1
• Filed: 09/18/2014
• Published: 07/21/2016
• Est. Priority Date: 10/15/2013
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: MOTOOKA, TOSHIYA, KITA, MASAKI, SHIGEMURA, HIROSHI, KURAHARA, YASUROU, TAMURA, SEIJI
• Granted Patent: US 10,126,179 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01K 1/08 Protective devices, e.g. casings
• CPC Class Codes: G01K 7/22 the element being a non-linear resistance, e.g. thermistor G01K7/26 takes precedence

Abstract

A temperature sensor includes a detector and a first mold-resin body. The detector includes: a temperature sensing element which is disposed at a first end part of the detector, a terminal which is disposed at a second end part of the detector, and a lead wire for coupling the temperature sensing element to the terminal. The first mold-resin body covers the temperature sensing element, a portion the terminal, and the lead wire. The temperature sensor further includes a second mold-resin body which covers an another portion of the terminal and the first mold-resin body; the another portion of the terminal is exposed from the first mold-resin body. Then, a gate mark is formed on a surface of the second mold-resin body; the surface faces a side of the first end part.

Claims

1. A temperature sensor comprising:

a detector including;

a temperature sensing element disposed at a first end part;

a terminal disposed at a second end part; and

a lead wire coupling the temperature sensing element to the terminals;

a first mold-resin body covering the temperature sensing element, a portion of the terminal, and the lead wire; and

a second mold-resin body covering an another portion of the terminal and the first mold-resin body, the another portion of the terminal being exposed from the first mold-resin body,

wherein a surface on which a gate mark of the second mold-resin body is formed faces a side of the first end part.

2. The temperature sensor according to claim 1,

wherein the first mold-resin body includes a first slope surface expanding from the first end part toward the second end part;

the second mold-resin body includes a second slope surface along the first slope surface, and a gate projection part protruding from the second slope surface toward the first end part; and

the gate mark is formed on the projection part.

3. The temperature sensor according to claim 2,

wherein a hole is disposed in a surface of the first mold-resin body, the surface of the first mold-resin body facing the second end part, and

a protrusion is disposed on an inner peripheral surface of the hole of the first mold-resin body.

4. The temperature sensor according to claim 3, wherein the protrusion has a ring shape along the inner peripheral surface of the hole.

5. A method of manufacturing a temperature sensor, the method comprising:

a first step of coupling a temperature sensing element to a terminal with a lead wire to form a detector;

a second step of forming a first mold-resin body to cover the temperature sensing element, a portion of the terminal, and the lead wire,

a third step of forming a second mold-resin body to cover the first mold-resin body and an another portion of the terminal, the another portion of the terminal being exposed from the first mold-resin body; and

wherein, in the third step, a mold resin is charged into a molding die along a first direction from a first end part where the temperature sensing element is disposed toward a second end part where a coupler part is disposed.