ELECTRO-STATIC DISCHARGE AND ELECTRIC OVERSTRESS PROTECTION STRATEGY FOR MICRO-CHIP ARRAY ON PANEL
First Claim
1. A display system comprising:
- a display substrate;
an array of light emitting diodes (LEDs) on the display substrate;
a first driver chip bonded to the display substrate, the first driver chip to drive a first group of LEDs of the array of LEDs;
a second driver chip bonded to the display substrate, the second driver chip to drive a second group of LEDs of the array of LEDs;
a first protection chip bonded to the display substrate, the first protection chip including one or more electro-static discharge (ESD) protection devices, wherein;
the one or more ESD protection devices are connected through one or more signal lines of the display substrate, one or more power supply voltage lines of the display substrate, and an electrical ground line of the display substrate to the first and second driver chips, andthe first protection chip is to assist with protecting the first and second driver chips from damage caused by an ESD event.
1 Assignment
0 Petitions
Accused Products
Abstract
A display system includes an array of light emitting diodes (LEDs), first and second driver chips, and one or more protection chips on a display substrate. The first and second driver chips are to drive a first group of LEDs of the array of LEDs and a second group of LEDs of the array of LEDs, respectively. Each protection chip includes one or more electro-static discharge (ESD) protection devices to assist with protecting the driver chips from damage caused by an ESD event. In one embodiment, each ESD protection device is connected between one or more signal lines, one or more power supply voltage lines, and an electrical ground line of the display substrate. In one embodiment, at least one protection chip comprises one or more electric overstress (EOS) protection devices to assist with protecting the driver chips from damage caused by an EOS event.
35 Citations
20 Claims
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1. A display system comprising:
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a display substrate; an array of light emitting diodes (LEDs) on the display substrate; a first driver chip bonded to the display substrate, the first driver chip to drive a first group of LEDs of the array of LEDs; a second driver chip bonded to the display substrate, the second driver chip to drive a second group of LEDs of the array of LEDs; a first protection chip bonded to the display substrate, the first protection chip including one or more electro-static discharge (ESD) protection devices, wherein; the one or more ESD protection devices are connected through one or more signal lines of the display substrate, one or more power supply voltage lines of the display substrate, and an electrical ground line of the display substrate to the first and second driver chips, and the first protection chip is to assist with protecting the first and second driver chips from damage caused by an ESD event. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method comprising:
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bonding a plurality of protection chips to a receiving display substrate, each of the protection chips comprises one or more electro-static discharge (ESD) protection devices; bonding an array of driver chips to the receiving display substrate; transferring an array of light emitting diodes (LEDs) onto the receiving display substrate, wherein; each of the driver chips is to drive at least one of the LEDs, each of the protection chips is to assist with protecting at least one of the driver chips from an ESD event; the one or more ESD protection devices of the protection chips are connected between one or more signal lines of the receiving display substrate, one or more power supply voltage lines of the receiving display substrate, and an electrical ground line of the receiving display substrate, and the plurality of protection chips are connected to the array of driver chips via one or more of the signal lines, one or more of the power supply voltage lines, and the electrical ground line. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification